NSN 5935-00-456-8984
Part Details | PLUG-IN ELECTRONIC COMPONENTS SOCKET
5935-00-456-8984 An item designed to electrically connect and mechanically position the base of an item having plug-in-type contacts, and to facilitate replacement of the item accommodated. It includes sockets which accommodate the contacts of capacitors, coils, crystals, electron tubes, relays, semiconductor devices and vibrators. Excludes sockets or receptacles designed to accommodate plug-in component circuit boards (printed circuit boards) and electronic modules or sub-assemblies. Also excludes heat-dissipating (not heat-sinks) sockets for mounting "power transistors".
Alternate Parts: MG1201, MG1201, 5935-00-456-8984, 00-456-8984, 5935004568984, 004568984
| Supply Group (FSG) | NSN Assigned | NIIN | Item Name Code (INC) |
|---|---|---|---|
| 59 | APR 25, 1969 | 00-456-8984 | 28914 ( SOCKET, PLUG-IN ELECTRONIC COMPONENTS ) |
REFERENCE DRAWINGS & PICTURES
TOP MOUNT, PRESS FIT
ROUND, BODY
CIRCULAR
Cross Reference | NSN 5935-00-456-8984
| Part Number | Cage Code | Manufacturer |
|---|---|---|
| MG1201 | 77820 | AMPHENOL CORPORATIONDBA AMPHENOL AEROSPACE OPERATIONS |
| MG1201 | 02660 | AMPHENOL CORPSPECTRA-STRIP/ITD |
Technical Data | NSN 5935-00-456-8984
| Characteristic | Specifications |
|---|---|
| CONTACT POSITION ARRANGEMENT STYLE | CIRCULAR |
| ACCOMMODATED CONTACT QUANTITY | 12 |
| CONTACT MATERIAL | BERYLLIUM COPPER |
| CONTACT SURFACE TREATMENT | U0000 ANY ACCEPTABLE AND G0000 ANY ACCEPTABLE |
| BODY STYLE | TOP MOUNT, PRESS FIT |
| TERMINAL LENGTH | 0.156 INCHES NOMINAL |
| OVERALL HEIGHT | 0.406 INCHES NOMINAL |
| OVERALL DIAMETER | 0.438 INCHES NOMINAL |
| PROJECTION LENGTH ABOVE MOUNTING SURFACE | 0.062 INCHES NOMINAL |
| BODY MATERIAL | PLASTIC |
| TERMINAL TYPE AND QUANTITY | 12 TAB, SOLDER LUG |
| MOUNTING TYPE FOR WHICH DESIGNED | CHASSIS |
| MOUNTING METHOD | PRESS FIT |
| MOUNTING HOLE STYLE | ROUND, BODY |
| BODY MOUNTING HOLE ACCOMMODATION DIAMETER | 0.375 INCHES NOMINAL |
| POLARIZATION TYPE | CONTACT POSITION |
| SPECIFIC EQUIPMENT ACCOMMODATED | SEMICONDUCTOR DEVICE |
| FABRICATION METHOD | MOLDED |
| PRECIOUS MATERIAL | GOLD AND SILVER |
| PRECIOUS MATERIAL AND WEIGHT | AUA000E0.012 GOLD AND AGA000E0.012 SILVER |
| PRECIOUS MATERIAL AND LOCATION | CONTACT SURFACES GOLD AND CONTACT SURFACES SILVER |