NSN 5961-01-102-1604

Part Details | UNITIZED SEMICONDUCTOR DEVICES

5961-01-102-1604 Two or more discrete semiconductor devices such as diode(s) and/or transistor(s), permanently cased, encapsulated, or potted together to form an inseparable unit. Excludes devices having one or more components other than semiconductor devices. The individually distinct devices forming the unit may be internally connected. The unit in itself does not perform a complete specific function and cannot be assigned a more definite item name. It may include or consist of inseparable matched pairs. May or may not include mounting hardware and/or heatsink. For interconnected items arranged in stack(s), see RECTIFIER, SEMICONDUCTOR DEVICE. For items formed on or within a semiconductor material substrate, formed on an insulating substrate or formed on a combination of both of these types, see MICROCIRCUIT (as modified). Excludes NETWORK (as modified); ABSORBER, OVERVOLTAGE; SEMICONDUCTOR DEVICE SET; and SEMICONDUCTOR DEVICE ASSEMBLY. Do not use if more specific name applies.

Alternate Parts: 1N6101, FSA3015M, C87461, C8746-1, 5961-01-102-1604, 01-102-1604, 5961011021604, 011021604

Supply Group (FSG) NSN Assigned NIIN Item Name Code (INC)
59OCT 12, 198001-102-160461962 ( SEMICONDUCTOR DEVICES, UNITIZED )
REFERENCE DRAWINGS & PICTURES
Cross Reference | NSN 5961-01-102-1604
Part Number Cage Code Manufacturer
1N610107261AVNET INC
FSA3015M07263FAIRCHILD SEMICONDUCTOR CORP
C8746-181755LOCKHEED MARTIN CORPORATIONDBA LOCKHEED MARTIN AERONAUTICS
Technical Data | NSN 5961-01-102-1604
Characteristic Specifications
COMPONENT NAME AND QUANTITY8 SEMICONDUCTOR DEVICE DIODE
MAXIMUM OPERATING TEMP PER MEASUREMENT POINTCAZL150.0 DEG CELSIUS
INCLOSURE MATERIAL PLASTIC
MOUNTING METHOD PRESS FIT
TERMINAL TYPE AND QUANTITY16 RIBBON
OVERALL LENGTH0.870 INCHES NOMINAL
OVERALL HEIGHT0.201 INCHES NOMINAL
OVERALL WIDTH0.320 INCHES NOMINAL