NSN 5961-01-165-5170
Part Details | DIODE SEMICONDUCTOR DEVICE
5961-01-165-5170 A two electrode semiconductor device having an asymmetrical voltage - current characteristic. May or may not include mounting hardware and/or heatsink. Excludes LIGHT EMITTING DIODE and SEMICONDUCTOR DEVICE,PHOTO. For items containing material such as selenium and copper oxide, see RECIFIER, METALLIC.
Alternate Parts: A2S220, UXA2S220, UXA2S220, 5961-01-165-5170, 01-165-5170, 5961011655170, 011655170
| Supply Group (FSG) | NSN Assigned | NIIN | Item Name Code (INC) |
|---|---|---|---|
| 59 | OCT 30, 1983 | 01-165-5170 | 20589 ( SEMICONDUCTOR DEVICE, DIODE ) |
REFERENCE DRAWINGS & PICTURES
Cross Reference | NSN 5961-01-165-5170
| Part Number | Cage Code | Manufacturer |
|---|---|---|
| A2S220 | 21847 | FEI MICROWAVE INC |
| UXA2S220 | 0EFF4 | MICROMETRICS INC |
| UXA2S220 | 3BBY6 | SEMI-GENERAL, INC. |
Technical Data | NSN 5961-01-165-5170
| Characteristic | Specifications |
|---|---|
| SEMICONDUCTOR MATERIAL | SILICON |
| VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | BCT3.0 MINIMUM |
| POWER RATING PER CHARACTERISTIC | BZCAF100.0 MILLIWATTS |
| CAPACITANCE RATING IN PICOFARADS | 0.08 NOMINAL |
| MAXIMUM OPERATING TEMP PER MEASUREMENT POINT | CAZL150.0 DEG CELSIUS |
| INCLOSURE MATERIAL | METAL |
| MOUNTING METHOD | PRESS FIT |
| TERMINAL TYPE AND QUANTITY | 2 BONDING PAD |
| OVERALL LENGTH | 0.050 INCHES MAXIMUM |
| OVERALL DIAMETER | 0.055 INCHES MAXIMUM |
| FEATURES PROVIDED | HERMETICALLY SEALED CASE |