NSN 5961-01-189-9373

Part Details | UNITIZED SEMICONDUCTOR DEVICES

5961-01-189-9373 Two or more discrete semiconductor devices such as diode(s) and/or transistor(s), permanently cased, encapsulated, or potted together to form an inseparable unit. Excludes devices having one or more components other than semiconductor devices. The individually distinct devices forming the unit may be internally connected. The unit in itself does not perform a complete specific function and cannot be assigned a more definite item name. It may include or consist of inseparable matched pairs. May or may not include mounting hardware and/or heatsink. For interconnected items arranged in stack(s), see RECTIFIER, SEMICONDUCTOR DEVICE. For items formed on or within a semiconductor material substrate, formed on an insulating substrate or formed on a combination of both of these types, see MICROCIRCUIT (as modified). Excludes NETWORK (as modified); ABSORBER, OVERVOLTAGE; SEMICONDUCTOR DEVICE SET; and SEMICONDUCTOR DEVICE ASSEMBLY. Do not use if more specific name applies.

Alternate Parts: 19900652, 1990-0652, 19900652, 1990-0652, 5961-01-189-9373, 01-189-9373, 5961011899373, 011899373

Supply Group (FSG) NSN Assigned NIIN Item Name Code (INC)
59SEP 21, 198401-189-937361962 ( SEMICONDUCTOR DEVICES, UNITIZED )
REFERENCE DRAWINGS & PICTURES
Cross Reference | NSN 5961-01-189-9373
Part Number Cage Code Manufacturer
1990-065250434AVAGO TECHNOLOGIES U.S. INC.DBA AVAGO TECHNOLOGIES
1990-065228480HEWLETT-PACKARD COMPANYDBA HP
Technical Data | NSN 5961-01-189-9373
Characteristic Specifications
COMPONENT NAME AND QUANTITY4 LIGHT EMITTING DIODE
INCLOSURE MATERIAL METAL
MOUNTING METHOD PRESS FIT
TERMINAL TYPE AND QUANTITY2 UNINSULATED WIRE LEAD
OVERALL LENGTH0.400 INCHES NOMINAL
OVERALL DIAMETER0.079 INCHES NOMINAL
FEATURES PROVIDED HERMETICALLY SEALED CASE
SPECIAL FEATURESALL LIGHT EMITTING DIODE JUNCTION PATTERN ARRANGEMENT: PN