NSN 5961-01-245-3669

Part Details | UNITIZED SEMICONDUCTOR DEVICES

5961-01-245-3669 Two or more discrete semiconductor devices such as diode(s) and/or transistor(s), permanently cased, encapsulated, or potted together to form an inseparable unit. Excludes devices having one or more components other than semiconductor devices. The individually distinct devices forming the unit may be internally connected. The unit in itself does not perform a complete specific function and cannot be assigned a more definite item name. It may include or consist of inseparable matched pairs. May or may not include mounting hardware and/or heatsink. For interconnected items arranged in stack(s), see RECTIFIER, SEMICONDUCTOR DEVICE. For items formed on or within a semiconductor material substrate, formed on an insulating substrate or formed on a combination of both of these types, see MICROCIRCUIT (as modified). Excludes NETWORK (as modified); ABSORBER, OVERVOLTAGE; SEMICONDUCTOR DEVICE SET; and SEMICONDUCTOR DEVICE ASSEMBLY. Do not use if more specific name applies.

Alternate Parts: MHQ3467HXV, HS50581001, HS5058-1001, FPQ3467, SA2738, MHQ3467HXV, 7568204001, 7568204-001, DH3467D883, DH3467D/883, DH3467DMIL, DH3467D-MIL, DH3467CN, DH3467CD883B, DH3467CD-883B, 4405425901, 44-054259-01, 4403831301, 44-038313-01, 8392330012, 839233-0012, 5961-01-245-3669, 01-245-3669, 5961012453669, 012453669

Supply Group (FSG) NSN Assigned NIIN Item Name Code (INC)
59NOV 26, 198601-245-366961962 ( SEMICONDUCTOR DEVICES, UNITIZED )
REFERENCE DRAWINGS & PICTURES
Cross Reference | NSN 5961-01-245-3669
Part Number Cage Code Manufacturer
MHQ3467HXV1S926AMERICAN MICROSEMICONDUCTOR INC
HS5058-10018V613BOEING COMPANY, THEDBA BOEING
FPQ346707263FAIRCHILD SEMICONDUCTOR CORP
SA273807933FAIRCHILD SEMICONDUCTOR CORPSEMICONDUCTOR DIV HQ
MHQ3467HXV04713FREESCALE SEMICONDUCTOR, INC.
7568204-00113160GENERAL DYNAMICS LAND SYSTEMS INC.DBA WOODBRIDGE TECHNICAL CENTER
DH3467D/88327014NATIONAL SEMICONDUCTOR CORPORATION
DH3467D-MIL27014NATIONAL SEMICONDUCTOR CORPORATION
DH3467CN27014NATIONAL SEMICONDUCTOR CORPORATION
DH3467CD-883B27014NATIONAL SEMICONDUCTOR CORPORATION
44-054259-0126916NORTHROP GRUMMAN SYSTEMS CORPORATIONDIV MULTIPLE
44-038313-0126916NORTHROP GRUMMAN SYSTEMS CORPORATIONDIV MULTIPLE
839233-001206481NORTHROP GRUMMAN SYSTEMS CORPORATIONDIV NAVIGATION AND MARITIME SYSTEMS
Technical Data | NSN 5961-01-245-3669
Characteristic Specifications
COMPONENT NAME AND QUANTITY4 TRANSISTOR
MAXIMUM OPERATING TEMP PER MEASUREMENT POINTCAZL200.0 DEG CELSIUS
INCLOSURE MATERIAL CERAMIC
JOINT ELECTRONIC DEVICE ENGINEERING COUNCIL/JEDEC/CASE OUTLINE DESIGNATIONTO-116
MOUNTING METHOD PRESS FIT
TERMINAL TYPE AND QUANTITY14 UNINSULATED WIRE LEAD
OVERALL LENGTH0.785 INCHES MAXIMUM
OVERALL HEIGHT0.200 INCHES MAXIMUM
OVERALL WIDTH0.325 INCHES MAXIMUM
FEATURES PROVIDED ELECTROSTATIC SENSITIVE AND HERMETICALLY SEALED CASE
SPECIAL FEATURESALL TRANSISTOR JUNCTION PATTERN ARRANGEMENT: PNP