NSN 5961-01-248-4374

Part Details | UNITIZED SEMICONDUCTOR DEVICES

5961-01-248-4374 Two or more discrete semiconductor devices such as diode(s) and/or transistor(s), permanently cased, encapsulated, or potted together to form an inseparable unit. Excludes devices having one or more components other than semiconductor devices. The individually distinct devices forming the unit may be internally connected. The unit in itself does not perform a complete specific function and cannot be assigned a more definite item name. It may include or consist of inseparable matched pairs. May or may not include mounting hardware and/or heatsink. For interconnected items arranged in stack(s), see RECTIFIER, SEMICONDUCTOR DEVICE. For items formed on or within a semiconductor material substrate, formed on an insulating substrate or formed on a combination of both of these types, see MICROCIRCUIT (as modified). Excludes NETWORK (as modified); ABSORBER, OVERVOLTAGE; SEMICONDUCTOR DEVICE SET; and SEMICONDUCTOR DEVICE ASSEMBLY. Do not use if more specific name applies.

Alternate Parts: BB104, BB-104, BB104, BB-104, 11784895, 5961-01-248-4374, 01-248-4374, 5961012484374, 012484374

Supply Group (FSG) NSN Assigned NIIN Item Name Code (INC)
59JAN 23, 198701-248-437461962 ( SEMICONDUCTOR DEVICES, UNITIZED )
REFERENCE DRAWINGS & PICTURES
Cross Reference | NSN 5961-01-248-4374
Part Number Cage Code Manufacturer
BB-104D1597AIM INFRAROT-MODULE GMBHDBA AIM IR GMBH
BB-10453673THOMSON-CSF COMPONENTS CORP
1178489519200US ARMY ARDEC RDECOM
Technical Data | NSN 5961-01-248-4374
Characteristic Specifications
COMPONENT NAME AND QUANTITY2 SEMICONDUCTOR DEVICE DIODE
INCLOSURE MATERIAL PLASTIC
MOUNTING METHOD TERMINAL
TERMINAL TYPE AND QUANTITY3 PIN
OVERALL LENGTH0.378 INCHES NOMINAL
OVERALL HEIGHT0.098 INCHES NOMINAL
OVERALL WIDTH0.300 INCHES NOMINAL
SPECIAL FEATURESCAPACITANCE RATIO=2.5 TO 2.8; ALL SEMICONDUCTOR DEVICE DIODE JUNCTION PATTERN ARRANGEMENT: PNP