NSN 5961-01-318-0139

Part Details | UNITIZED SEMICONDUCTOR DEVICES

5961-01-318-0139 Two or more discrete semiconductor devices such as diode(s) and/or transistor(s), permanently cased, encapsulated, or potted together to form an inseparable unit. Excludes devices having one or more components other than semiconductor devices. The individually distinct devices forming the unit may be internally connected. The unit in itself does not perform a complete specific function and cannot be assigned a more definite item name. It may include or consist of inseparable matched pairs. May or may not include mounting hardware and/or heatsink. For interconnected items arranged in stack(s), see RECTIFIER, SEMICONDUCTOR DEVICE. For items formed on or within a semiconductor material substrate, formed on an insulating substrate or formed on a combination of both of these types, see MICROCIRCUIT (as modified). Excludes NETWORK (as modified); ABSORBER, OVERVOLTAGE; SEMICONDUCTOR DEVICE SET; and SEMICONDUCTOR DEVICE ASSEMBLY. Do not use if more specific name applies.

Alternate Parts: 19060279, 1906-0279, 19060279, 1906-0279, DMJ4708, 5961-01-318-0139, 01-318-0139, 5961013180139, 013180139

Supply Group (FSG) NSN Assigned NIIN Item Name Code (INC)
59APR 11, 199001-318-013961962 ( SEMICONDUCTOR DEVICES, UNITIZED )
REFERENCE DRAWINGS & PICTURES
Cross Reference | NSN 5961-01-318-0139
Part Number Cage Code Manufacturer
1906-027950434AVAGO TECHNOLOGIES U.S. INC.DBA AVAGO TECHNOLOGIES
1906-027928480HEWLETT-PACKARD COMPANYDBA HP
DMJ470817540SKYWORKS SOLUTIONS, INC.
Technical Data | NSN 5961-01-318-0139
Characteristic Specifications
COMPONENT NAME AND QUANTITY8 SEMICONDUCTOR DEVICE DIODE
MAXIMUM OPERATING TEMP PER MEASUREMENT POINTCAZN165.0 DEG CELSIUS
INCLOSURE MATERIAL CERAMIC
MOUNTING METHOD PRESS FIT
TERMINAL TYPE AND QUANTITY4 PIN
OVERALL LENGTH0.040 INCHES MAXIMUM
OVERALL DIAMETER0.095 INCHES MINIMUM AND 0.105 INCHES MAXIMUM