NSN 5961-01-331-6825
Part Details | TRANSISTOR
5961-01-331-6825 An active semiconductor device with three or more electrodes. May or may not include mounting hardware and/or heatsink. Excludes SEMICONDUCTOR DEVICE, DIODE and SEMICONDUCTOR DEVICE, THYRISTOR. For solid state devices which are responsive to visible or infrared radiant energy, see SEMICONDUCTOR DEVICE, PHOTO.
Alternate Parts: 4720034001, 472-0034-001, 4720034001, 472-0034-001, 132682292, 13-268229-2, 5961-01-331-6825, 01-331-6825, 5961013316825, 013316825
| Supply Group (FSG) | NSN Assigned | NIIN | Item Name Code (INC) |
|---|---|---|---|
| 59 | DEC 22, 1990 | 01-331-6825 | 20588 ( TRANSISTOR ) |
REFERENCE DRAWINGS & PICTURES
Cross Reference | NSN 5961-01-331-6825
| Part Number | Cage Code | Manufacturer |
|---|---|---|
| 472-0034-001 | 94756 | BOEING COMPANY, THEDBA BOEING |
| 472-0034-001 | 53399 | GPD OPTOELECTRONICS CORP.DIV GPD OPTOELECTRONICS |
| 13-268229-2 | 11293 | GTE GOVERNMENT SYSTEMS CORPSTRATEGIC SYSTEMS DIV |
Technical Data | NSN 5961-01-331-6825
| Characteristic | Specifications |
|---|---|
| SEMICONDUCTOR MATERIAL | GERMANIUM |
| VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | CAMM15.0 MAXIMUM AND CARM15.0 MAXIMUM AND CAPM6.0 MAXIMUM AND CBAM2.0 MAXIMUM COLLECTOR TO BASE VOLTAGE/STATIC/EMITTER OPEN |
| CURRENT RATING PER CHARACTERISTIC | BACACM100.00 MILLIAMPERES NOMINAL AND BACAB100.00 MILLIAMPERES NOMINAL |
| POWER RATING PER CHARACTERISTIC | BZCAB150.0 MILLIWATTS |
| MAXIMUM OPERATING TEMP PER MEASUREMENT POINT | CAZM100.0 DEG CELSIUS |
| INCLOSURE MATERIAL | METAL |
| MOUNTING METHOD | TERMINAL |
| TERMINAL LENGTH | 0.170 INCHES MINIMUM |
| TERMINAL CIRCLE DIAMETER | 0.017 INCHES MINIMUM AND 0.019 INCHES MAXIMUM |
| TERMINAL TYPE AND QUANTITY | 3 PIN |
| OVERALL LENGTH | 0.170 INCHES MINIMUM AND 0.230 INCHES MAXIMUM |
| OVERALL DIAMETER | 0.205 INCHES MINIMUM AND 0.230 INCHES MAXIMUM |
| NUCLEAR HARDNESS CRITICAL FEATURE | HARDENED |
| END ITEM IDENTIFICATION | MODULE ASSEMBLY,5820-00-904-5652,P/N 25-45100-6 |