NSN 5961-01-331-8729

Part Details | UNITIZED SEMICONDUCTOR DEVICES

5961-01-331-8729 Two or more discrete semiconductor devices such as diode(s) and/or transistor(s), permanently cased, encapsulated, or potted together to form an inseparable unit. Excludes devices having one or more components other than semiconductor devices. The individually distinct devices forming the unit may be internally connected. The unit in itself does not perform a complete specific function and cannot be assigned a more definite item name. It may include or consist of inseparable matched pairs. May or may not include mounting hardware and/or heatsink. For interconnected items arranged in stack(s), see RECTIFIER, SEMICONDUCTOR DEVICE. For items formed on or within a semiconductor material substrate, formed on an insulating substrate or formed on a combination of both of these types, see MICROCIRCUIT (as modified). Excludes NETWORK (as modified); ABSORBER, OVERVOLTAGE; SEMICONDUCTOR DEVICE SET; and SEMICONDUCTOR DEVICE ASSEMBLY. Do not use if more specific name applies.

Alternate Parts: 1504750771, 15047-507-71, LE41100010025, LE411-0001-0025, BP15108, 5961-01-331-8729, 01-331-8729, 5961013318729, 013318729

Supply Group (FSG) NSN Assigned NIIN Item Name Code (INC)
59DEC 29, 199001-331-872961962 ( SEMICONDUCTOR DEVICES, UNITIZED )
REFERENCE DRAWINGS & PICTURES
Cross Reference | NSN 5961-01-331-8729
Part Number Cage Code Manufacturer
15047-507-7194756BOEING COMPANY, THEDBA BOEING
LE411-0001-002543999BOEING COMPANY, THEDBA BOEING
BP1510827361BURKE PRODUCTS, INC.
Technical Data | NSN 5961-01-331-8729
Characteristic Specifications
COMPONENT NAME AND QUANTITY2 SEMICONDUCTOR DEVICE DIODE
MAXIMUM OPERATING TEMP PER MEASUREMENT POINTCAZN200.0 DEG CELSIUS
INCLOSURE MATERIAL GLASS
MOUNTING METHOD TERMINAL
TERMINAL LENGTH1.000 INCHES MINIMUM AND 1.500 INCHES MAXIMUM
TERMINAL TYPE AND QUANTITY2 UNINSULATED WIRE LEAD
OVERALL LENGTH0.140 INCHES MINIMUM AND 0.180 INCHES MAXIMUM
OVERALL DIAMETER0.056 INCHES MINIMUM AND 0.075 INCHES MAXIMUM
FUNCTION FOR WHICH DESIGNED SWITCHING
FEATURES PROVIDED HERMETICALLY SEALED CASE
SPECIAL FEATURESALL SEMICONDUCTOR DEVICE DIODE JUNCTION PATTERN ARRANGEMENT: PN