NSN 5961-01-332-9508

Part Details | UNITIZED SEMICONDUCTOR DEVICES

5961-01-332-9508 Two or more discrete semiconductor devices such as diode(s) and/or transistor(s), permanently cased, encapsulated, or potted together to form an inseparable unit. Excludes devices having one or more components other than semiconductor devices. The individually distinct devices forming the unit may be internally connected. The unit in itself does not perform a complete specific function and cannot be assigned a more definite item name. It may include or consist of inseparable matched pairs. May or may not include mounting hardware and/or heatsink. For interconnected items arranged in stack(s), see RECTIFIER, SEMICONDUCTOR DEVICE. For items formed on or within a semiconductor material substrate, formed on an insulating substrate or formed on a combination of both of these types, see MICROCIRCUIT (as modified). Excludes NETWORK (as modified); ABSORBER, OVERVOLTAGE; SEMICONDUCTOR DEVICE SET; and SEMICONDUCTOR DEVICE ASSEMBLY. Do not use if more specific name applies.

Alternate Parts: 790693711, 7906937-11, UTG5258, UES2606HR2, 5961-01-332-9508, 01-332-9508, 5961013329508, 013329508

Supply Group (FSG) NSN Assigned NIIN Item Name Code (INC)
59JAN 19, 199101-332-950861962 ( SEMICONDUCTOR DEVICES, UNITIZED )
REFERENCE DRAWINGS & PICTURES
Cross Reference | NSN 5961-01-332-9508
Part Number Cage Code Manufacturer
7906937-1190536LOCKHEED MARTIN CORPORATIONDBA LOCKHEED MARTIN
UTG525812969MICRO USPD INC
UES2606HR243611MICROSEMI CORP.- MASSACHUSETTSDBA MICROSEMI-LAWRENCE
Technical Data | NSN 5961-01-332-9508
Characteristic Specifications
COMPONENT NAME AND QUANTITY2 SEMICONDUCTOR DEVICE DIODE
MAXIMUM OPERATING TEMP PER MEASUREMENT POINTCAZN150.0 DEG CELSIUS
INCLOSURE MATERIAL METAL
ELECTRODE INTERNALLY-ELECTRICALLY CONNECTED TO CASE CATHODE
MOUNTING METHOD UNTHREADED HOLE
MOUNTING FACILITY QUANTITY2
TERMINAL TYPE AND QUANTITY2 PIN AND 2 CASE
OVERALL LENGTH1.573 INCHES MAXIMUM
OVERALL HEIGHT0.250 INCHES MINIMUM AND 0.450 INCHES MAXIMUM
OVERALL WIDTH1.050 INCHES MAXIMUM
FEATURES PROVIDED BURN IN AND HERMETICALLY SEALED CASE
SPECIAL FEATURESALL SEMICONDUCTOR DEVICE DIODE JUNCTION PATTERN ARRANGEMENT: PN