NSN 5961-01-350-1244
Part Details | DIODE SEMICONDUCTOR DEVICE
5961-01-350-1244 A two electrode semiconductor device having an asymmetrical voltage - current characteristic. May or may not include mounting hardware and/or heatsink. Excludes LIGHT EMITTING DIODE and SEMICONDUCTOR DEVICE,PHOTO. For items containing material such as selenium and copper oxide, see RECIFIER, METALLIC.
Alternate Parts: 6120590070, 61205-90070, DP102147000, DP102147-000, GC41315, NE14008, GC41315, DP102147000, DP102147-000, 5961-01-350-1244, 01-350-1244, 5961013501244, 013501244
| Supply Group (FSG) | NSN Assigned | NIIN | Item Name Code (INC) |
|---|---|---|---|
| 59 | DEC 10, 1991 | 01-350-1244 | 20589 ( SEMICONDUCTOR DEVICE, DIODE ) |
REFERENCE DRAWINGS & PICTURES
Cross Reference | NSN 5961-01-350-1244
| Part Number | Cage Code | Manufacturer |
|---|---|---|
| 61205-90070 | 97384 | AAI CORPORATIONDBA TEXTRON SYSTEMS |
| DP102147-000 | 96341 | COBHAM ADVANCED ELECTRONIC SOLUTIONSINC. |
| GC41315 | 26629 | LOCKHEED MARTIN CORPORATIONDBA LOCKHEED MARTIN MISSILES AND |
| NE14008 | 54487 | MERCURY COMMERCIAL ELECTRONICS, INC.DBA MICRONETICS |
| GC41315 | 50101 | MICROSEMI CORP-MASSACHUSETTSDBA MICROSEMI-LOWELL |
| DP102147-000 | 54558 | SDI INC |
Technical Data | NSN 5961-01-350-1244
| Characteristic | Specifications |
|---|---|
| SEMICONDUCTOR MATERIAL | SILICON |
| VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | BCT100.0 MINIMUM |
| CURRENT RATING PER CHARACTERISTIC | CKCCH10.00 MICROAMPERES |
| POWER RATING PER CHARACTERISTIC | BZCAB200.0 MILLIWATTS |
| CAPACITANCE RATING IN PICOFARADS | 0.1 MAXIMUM |
| MAXIMUM OPERATING TEMP PER MEASUREMENT POINT | CAZL85.0 DEG CELSIUS |
| INCLOSURE MATERIAL | METAL |
| MOUNTING METHOD | PRESS FIT |
| TERMINAL TYPE AND QUANTITY | 1 BONDING PAD |
| OVERALL LENGTH | 0.013 INCHES NOMINAL |
| OVERALL HEIGHT | 0.005 INCHES MINIMUM AND 0.008 INCHES MAXIMUM |
| OVERALL WIDTH | 0.013 INCHES NOMINAL |
| FUNCTION FOR WHICH DESIGNED | SWITCHING |
| FEATURES PROVIDED | MOUNTING PAD |
| SPECIAL FEATURES | THE DIODE SHALL BE CAPABLE OF FULFILLING ALL REQUIREMENTS WHEN ATTACHED TO GOLD PLATED ALUMINUM USING A SILVER FILLED CONDUCTIVE EPOXY; JUNCTION PATTERN ARRANGEMENT: PN |
| PRECIOUS MATERIAL | GOLD |
| PRECIOUS MATERIAL AND LOCATION | TERMINAL SURFACES GOLD |