NSN 5961-01-351-0528

Part Details | UNITIZED SEMICONDUCTOR DEVICES

5961-01-351-0528 Two or more discrete semiconductor devices such as diode(s) and/or transistor(s), permanently cased, encapsulated, or potted together to form an inseparable unit. Excludes devices having one or more components other than semiconductor devices. The individually distinct devices forming the unit may be internally connected. The unit in itself does not perform a complete specific function and cannot be assigned a more definite item name. It may include or consist of inseparable matched pairs. May or may not include mounting hardware and/or heatsink. For interconnected items arranged in stack(s), see RECTIFIER, SEMICONDUCTOR DEVICE. For items formed on or within a semiconductor material substrate, formed on an insulating substrate or formed on a combination of both of these types, see MICROCIRCUIT (as modified). Excludes NETWORK (as modified); ABSORBER, OVERVOLTAGE; SEMICONDUCTOR DEVICE SET; and SEMICONDUCTOR DEVICE ASSEMBLY. Do not use if more specific name applies.

Alternate Parts: CSD124, 60008, SG11942, FDA3141H, H980114001B, H980114-001B, 5961-01-351-0528, 01-351-0528, 5961013510528, 013510528

Supply Group (FSG) NSN Assigned NIIN Item Name Code (INC)
59DEC 28, 199101-351-052861962 ( SEMICONDUCTOR DEVICES, UNITIZED )
REFERENCE DRAWINGS & PICTURES
Cross Reference | NSN 5961-01-351-0528
Part Number Cage Code Manufacturer
CSD12457300CHIP SUPPLY, INC.DBA MICROSS COMPONENTS
600085T331INDY ELECTRONICS INC
SG1194234333MICROSEMI CORP.-INTEGRATED PRODUCTS
FDA3141H27014NATIONAL SEMICONDUCTOR CORPORATION
H980114-001B82577RAYTHEON COMPANYDBA RAYTHEON
Technical Data | NSN 5961-01-351-0528
Characteristic Specifications
COMPONENT NAME AND QUANTITY10 SEMICONDUCTOR DEVICE DIODE
MAXIMUM OPERATING TEMP PER MEASUREMENT POINTCAZL125.0 DEG CELSIUS
INCLOSURE MATERIAL METAL
MOUNTING METHOD TERMINAL
TERMINAL LENGTH0.100 INCHES MINIMUM AND 0.165 INCHES MAXIMUM
TERMINAL TYPE AND QUANTITY16 PIN
OVERALL LENGTH0.755 INCHES MINIMUM AND 0.785 INCHES MAXIMUM
OVERALL HEIGHT0.200 INCHES MAXIMUM
OVERALL WIDTH0.245 INCHES MINIMUM AND 0.271 INCHES MAXIMUM
FEATURES PROVIDED HERMETICALLY SEALED CASE
SPECIAL FEATURESALL SEMICONDUCTOR DEVICE DIODE JUNCTION PATTERN ARRANGEMENT: PN