NSN 5961-01-363-4678

Part Details | UNITIZED SEMICONDUCTOR DEVICES

5961-01-363-4678 Two or more discrete semiconductor devices such as diode(s) and/or transistor(s), permanently cased, encapsulated, or potted together to form an inseparable unit. Excludes devices having one or more components other than semiconductor devices. The individually distinct devices forming the unit may be internally connected. The unit in itself does not perform a complete specific function and cannot be assigned a more definite item name. It may include or consist of inseparable matched pairs. May or may not include mounting hardware and/or heatsink. For interconnected items arranged in stack(s), see RECTIFIER, SEMICONDUCTOR DEVICE. For items formed on or within a semiconductor material substrate, formed on an insulating substrate or formed on a combination of both of these types, see MICROCIRCUIT (as modified). Excludes NETWORK (as modified); ABSORBER, OVERVOLTAGE; SEMICONDUCTOR DEVICE SET; and SEMICONDUCTOR DEVICE ASSEMBLY. Do not use if more specific name applies.

Alternate Parts: FSA3256M.02, 12554003, 5961-01-363-4678, 01-363-4678, 5961013634678, 013634678

Supply Group (FSG) NSN Assigned NIIN Item Name Code (INC)
59AUG 29, 199201-363-467861962 ( SEMICONDUCTOR DEVICES, UNITIZED )
REFERENCE DRAWINGS & PICTURES
Cross Reference | NSN 5961-01-363-4678
Part Number Cage Code Manufacturer
FSA3256M.0227014NATIONAL SEMICONDUCTOR CORPORATION
1255400319200US ARMY ARDEC RDECOM
Technical Data | NSN 5961-01-363-4678
Characteristic Specifications
COMPONENT NAME AND QUANTITY16 SEMICONDUCTOR DEVICE DIODE
MAXIMUM OPERATING TEMP PER MEASUREMENT POINTCAZN150.0 DEG CELSIUS
INCLOSURE MATERIAL PLASTIC
MOUNTING METHOD TERMINAL
TERMINAL TYPE AND QUANTITY14 PRINTED CIRCUIT
OVERALL LENGTH0.750 INCHES MINIMUM AND 0.785 INCHES MAXIMUM
OVERALL HEIGHT0.200 INCHES MAXIMUM
OVERALL WIDTH0.245 INCHES MINIMUM AND 0.271 INCHES MAXIMUM
SPECIAL FEATURESSINGLE SEMICONDUCTOR DEVICE DIODE JUNCTION PATTERN ARRANGEMENT: PN