NSN 5961-01-381-8571

Part Details | UNITIZED SEMICONDUCTOR DEVICES

5961-01-381-8571 Two or more discrete semiconductor devices such as diode(s) and/or transistor(s), permanently cased, encapsulated, or potted together to form an inseparable unit. Excludes devices having one or more components other than semiconductor devices. The individually distinct devices forming the unit may be internally connected. The unit in itself does not perform a complete specific function and cannot be assigned a more definite item name. It may include or consist of inseparable matched pairs. May or may not include mounting hardware and/or heatsink. For interconnected items arranged in stack(s), see RECTIFIER, SEMICONDUCTOR DEVICE. For items formed on or within a semiconductor material substrate, formed on an insulating substrate or formed on a combination of both of these types, see MICROCIRCUIT (as modified). Excludes NETWORK (as modified); ABSORBER, OVERVOLTAGE; SEMICONDUCTOR DEVICE SET; and SEMICONDUCTOR DEVICE ASSEMBLY. Do not use if more specific name applies.

Alternate Parts: 265610002, 26561-0002, DZ890124D, GZ94811B, 5961-01-381-8571, 01-381-8571, 5961013818571, 013818571

Supply Group (FSG) NSN Assigned NIIN Item Name Code (INC)
59OCT 23, 199301-381-857161962 ( SEMICONDUCTOR DEVICES, UNITIZED )
REFERENCE DRAWINGS & PICTURES
Cross Reference | NSN 5961-01-381-8571
Part Number Cage Code Manufacturer
26561-000219397BAE SYSTEMS INFORMATION ANDELECTRONIC SYSTEMS INTEGRATION INC.
DZ890124D12954MICROSEMI CORP.-SCOTTSDALEDBA MICROSEMI
GZ94811B0U8A3PROTEK DEVICES LPDBA PROTEK DEVICES
Technical Data | NSN 5961-01-381-8571
Characteristic Specifications
COMPONENT NAME AND QUANTITY15 SEMICONDUCTOR DEVICE DIODE
INCLOSURE MATERIAL PLASTIC
MOUNTING METHOD PRESS FIT
TERMINAL TYPE AND QUANTITY16 RIBBON
OVERALL LENGTH0.895 INCHES MINIMUM AND 0.925 INCHES MAXIMUM
OVERALL HEIGHT0.217 INCHES NOMINAL
OVERALL WIDTH0.450 INCHES MINIMUM AND 0.480 INCHES MAXIMUM
FEATURES PROVIDED BURN IN AND ELECTROSTATIC SENSITIVE AND HERMETICALLY SEALED CASE AND QUALITY ASSURANCE LEVEL TXV
SPECIAL FEATURESALL SEMICONDUCTOR DEVICE DIODE JUNCTION PATTERN ARRANGEMENT: PN