NSN 5961-01-381-8571
Part Details | UNITIZED SEMICONDUCTOR DEVICES
5961-01-381-8571 Two or more discrete semiconductor devices such as diode(s) and/or transistor(s), permanently cased, encapsulated, or potted together to form an inseparable unit. Excludes devices having one or more components other than semiconductor devices. The individually distinct devices forming the unit may be internally connected. The unit in itself does not perform a complete specific function and cannot be assigned a more definite item name. It may include or consist of inseparable matched pairs. May or may not include mounting hardware and/or heatsink. For interconnected items arranged in stack(s), see RECTIFIER, SEMICONDUCTOR DEVICE. For items formed on or within a semiconductor material substrate, formed on an insulating substrate or formed on a combination of both of these types, see MICROCIRCUIT (as modified). Excludes NETWORK (as modified); ABSORBER, OVERVOLTAGE; SEMICONDUCTOR DEVICE SET; and SEMICONDUCTOR DEVICE ASSEMBLY. Do not use if more specific name applies.
Alternate Parts: 265610002, 26561-0002, DZ890124D, GZ94811B, 5961-01-381-8571, 01-381-8571, 5961013818571, 013818571
| Supply Group (FSG) | NSN Assigned | NIIN | Item Name Code (INC) |
|---|---|---|---|
| 59 | OCT 23, 1993 | 01-381-8571 | 61962 ( SEMICONDUCTOR DEVICES, UNITIZED ) |
REFERENCE DRAWINGS & PICTURES
Cross Reference | NSN 5961-01-381-8571
| Part Number | Cage Code | Manufacturer |
|---|---|---|
| 26561-0002 | 19397 | BAE SYSTEMS INFORMATION ANDELECTRONIC SYSTEMS INTEGRATION INC. |
| DZ890124D | 12954 | MICROSEMI CORP.-SCOTTSDALEDBA MICROSEMI |
| GZ94811B | 0U8A3 | PROTEK DEVICES LPDBA PROTEK DEVICES |
Technical Data | NSN 5961-01-381-8571
| Characteristic | Specifications |
|---|---|
| COMPONENT NAME AND QUANTITY | 15 SEMICONDUCTOR DEVICE DIODE |
| INCLOSURE MATERIAL | PLASTIC |
| MOUNTING METHOD | PRESS FIT |
| TERMINAL TYPE AND QUANTITY | 16 RIBBON |
| OVERALL LENGTH | 0.895 INCHES MINIMUM AND 0.925 INCHES MAXIMUM |
| OVERALL HEIGHT | 0.217 INCHES NOMINAL |
| OVERALL WIDTH | 0.450 INCHES MINIMUM AND 0.480 INCHES MAXIMUM |
| FEATURES PROVIDED | BURN IN AND ELECTROSTATIC SENSITIVE AND HERMETICALLY SEALED CASE AND QUALITY ASSURANCE LEVEL TXV |
| SPECIAL FEATURES | ALL SEMICONDUCTOR DEVICE DIODE JUNCTION PATTERN ARRANGEMENT: PN |