NSN 5961-01-464-1836

Part Details | UNITIZED SEMICONDUCTOR DEVICES

5961-01-464-1836 Two or more discrete semiconductor devices such as diode(s) and/or transistor(s), permanently cased, encapsulated, or potted together to form an inseparable unit. Excludes devices having one or more components other than semiconductor devices. The individually distinct devices forming the unit may be internally connected. The unit in itself does not perform a complete specific function and cannot be assigned a more definite item name. It may include or consist of inseparable matched pairs. May or may not include mounting hardware and/or heatsink. For interconnected items arranged in stack(s), see RECTIFIER, SEMICONDUCTOR DEVICE. For items formed on or within a semiconductor material substrate, formed on an insulating substrate or formed on a combination of both of these types, see MICROCIRCUIT (as modified). Excludes NETWORK (as modified); ABSORBER, OVERVOLTAGE; SEMICONDUCTOR DEVICE SET; and SEMICONDUCTOR DEVICE ASSEMBLY. Do not use if more specific name applies.

Alternate Parts: ND412G2, ND412G-2, 5961-01-464-1836, 01-464-1836, 5961014641836, 014641836

Supply Group (FSG) NSN Assigned NIIN Item Name Code (INC)
59APR 20, 199901-464-183661962 ( SEMICONDUCTOR DEVICES, UNITIZED )
REFERENCE DRAWINGS & PICTURES
Cross Reference | NSN 5961-01-464-1836
Part Number Cage Code Manufacturer
ND412G-233297NEC ELECTRONICS USA INCELECTRONIC ARRAYS DIV
Technical Data | NSN 5961-01-464-1836
Characteristic Specifications
COMPONENT NAME AND QUANTITY2 SEMICONDUCTOR DEVICE DIODE
MAXIMUM OPERATING TEMP PER MEASUREMENT POINTCAZMM55.0 DEG CELSIUS AND CAZM125.0 DEG CELSIUS
INCLOSURE MATERIAL PLASTIC
MOUNTING METHOD TERMINAL
MOUNTING FACILITY QUANTITY4
TERMINAL LENGTH2.900 MILLIMETERS MAXIMUM
TERMINAL TYPE AND QUANTITY4 UNINSULATED WIRE LEAD
OVERALL LENGTH2.800 MILLIMETERS MAXIMUM
OVERALL HEIGHT1.100 MILLIMETERS MAXIMUM
OVERALL WIDTH2.800 MILLIMETERS MAXIMUM
SPECIAL FEATURESWIDEBANDOPERATION
END ITEM IDENTIFICATION6625014252551E/IFSCM33297