NSN 5961-01-502-3723
Part Details | DIODE SEMICONDUCTOR DEVICE
5961-01-502-3723 A two electrode semiconductor device having an asymmetrical voltage - current characteristic. May or may not include mounting hardware and/or heatsink. Excludes LIGHT EMITTING DIODE and SEMICONDUCTOR DEVICE,PHOTO. For items containing material such as selenium and copper oxide, see RECIFIER, METALLIC.
Alternate Parts: MLL750A1, MLL750A-1, 5961-01-502-3723, 01-502-3723, 5961015023723, 015023723
| Supply Group (FSG) | NSN Assigned | NIIN | Item Name Code (INC) |
|---|---|---|---|
| 59 | NOV 04, 2002 | 01-502-3723 | 20589 ( SEMICONDUCTOR DEVICE, DIODE ) |
REFERENCE DRAWINGS & PICTURES
Cross Reference | NSN 5961-01-502-3723
| Part Number | Cage Code | Manufacturer |
|---|---|---|
| MLL750A-1 | 12954 | MICROSEMI CORP.-SCOTTSDALEDBA MICROSEMI |
Technical Data | NSN 5961-01-502-3723
| Characteristic | Specifications |
|---|---|
| SEMICONDUCTOR MATERIAL | SILICON |
| VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | CGD4.7 MAXIMUM |
| CURRENT RATING PER CHARACTERISTIC | BACAS75.00 MILLIAMPERES NOMINAL AND BACCH2.00 MILLIAMPERES NOMINAL |
| INCLOSURE MATERIAL | GLASS |
| JOINT ELECTRONIC DEVICE ENGINEERING COUNCIL/JEDEC/CASE OUTLINE DESIGNATION | DO-213AA |
| MOUNTING METHOD | TERMINAL |
| TERMINAL TYPE AND QUANTITY | 2 BONDING PAD |
| OVERALL LENGTH | 0.130 INCHES MINIMUM AND 0.146 INCHES MAXIMUM |
| OVERALL DIAMETER | 0.063 INCHES MINIMUM AND 0.067 INCHES MAXIMUM |
| END ITEM IDENTIFICATION | F/A-18E/F HORNET AIRCRAFT; CENTRAL PROCESSOR |