NSN 5961-01-538-0422
Part Details | TRANSISTOR
5961-01-538-0422 An active semiconductor device with three or more electrodes. May or may not include mounting hardware and/or heatsink. Excludes SEMICONDUCTOR DEVICE, DIODE and SEMICONDUCTOR DEVICE, THYRISTOR. For solid state devices which are responsive to visible or infrared radiant energy, see SEMICONDUCTOR DEVICE, PHOTO.
Alternate Parts: IRFIBC30G, 5961-01-538-0422, 01-538-0422, 5961015380422, 015380422
| Supply Group (FSG) | NSN Assigned | NIIN | Item Name Code (INC) |
|---|---|---|---|
| 59 | MAR 08, 2006 | 01-538-0422 | 20588 ( TRANSISTOR ) |
REFERENCE DRAWINGS & PICTURES
Cross Reference | NSN 5961-01-538-0422
| Part Number | Cage Code | Manufacturer |
|---|---|---|
| IRFIBC30G | 81483 | INFINEON TECHNOLOGIES AMERICAS CORP.DBA I R |
Technical Data | NSN 5961-01-538-0422
| Characteristic | Specifications |
|---|---|
| CURRENT RATING PER CHARACTERISTIC | AACAD2.50 AMPERES NOMINAL AND AABAD1.60 AMPERES NOMINAL |
| MOUNTING METHOD | CLIP |
| OVERALL LENGTH | 1.142 INCHES MINIMUM AND 1.176 INCHES MAXIMUM |
| OVERALL HEIGHT | 0.180 INCHES MINIMUM AND 0.190 INCHES MAXIMUM |
| OVERALL WIDTH | 0.408 INCHES MINIMUM AND 0.419 INCHES MAXIMUM |
| SPECIAL FEATURES | ISOLATED PACKAGE; HIGH VOLTAGE ISOLATION=2.5 KVRMS; SINK TO LEAD CREEPAGE DIST=4.8MM; DYNAMIC DV/DT RATING; LOW THERMAL RESISTANCE; LEAD FREE; THE TO-220 FULLPAK ELIMINATES THE NEED FOR ADDITIONAL INSULATING HARDWARE IN COMMERCIAL-INDUSTRIAL APPLICATIONS; THE MOULDING COMPOUND USED PROVIDES A HIGH ISOLATION CAPABILITY AND A LOW THEMAL RESISTANCE BETWEEN THE TAP AND EXTERNA HEATSINK; THIS ISOLATION IS EQUIVALENT TO USING A 100 MICRON MICA BARRIER WITH STANDARD TO-220 PRODUCT THE FULLPAK IS MOUNTED TO A HEATSINK USING A SINGLE CLIP OR BY A SINGLE SCREW FIXING |
| PART NAME ASSIGNED BY CONTROLLING AGENCY | TO-220 FULLPAK |