NSN 5961-01-641-4121

Part Details | UNITIZED SEMICONDUCTOR DEVICES

5961-01-641-4121 Two or more discrete semiconductor devices such as diode(s) and/or transistor(s), permanently cased, encapsulated, or potted together to form an inseparable unit. Excludes devices having one or more components other than semiconductor devices. The individually distinct devices forming the unit may be internally connected. The unit in itself does not perform a complete specific function and cannot be assigned a more definite item name. It may include or consist of inseparable matched pairs. May or may not include mounting hardware and/or heatsink. For interconnected items arranged in stack(s), see RECTIFIER, SEMICONDUCTOR DEVICE. For items formed on or within a semiconductor material substrate, formed on an insulating substrate or formed on a combination of both of these types, see MICROCIRCUIT (as modified). Excludes NETWORK (as modified); ABSORBER, OVERVOLTAGE; SEMICONDUCTOR DEVICE SET; and SEMICONDUCTOR DEVICE ASSEMBLY. Do not use if more specific name applies.

Alternate Parts: SKKT32312E, SKKT323/12E, 5961-01-641-4121, 01-641-4121, 5961016414121, 016414121

Supply Group (FSG) NSN Assigned NIIN Item Name Code (INC)
59JAN 21, 201501-641-412161962 ( SEMICONDUCTOR DEVICES, UNITIZED )
REFERENCE DRAWINGS & PICTURES
Cross Reference | NSN 5961-01-641-4121
Part Number Cage Code Manufacturer
SKKT323/12E58687SEMIKRON INTL INC
Technical Data | NSN 5961-01-641-4121
Characteristic Specifications
INCLOSURE MATERIAL CERAMIC
MOUNTING METHOD TERMINAL
TERMINAL TYPE AND QUANTITY7 PIN
OVERALL LENGTH115.0 MILLIMETERS NOMINAL
SPECIAL FEATURESELECTRICALLY INSULATED BASE PLATE; HEAT TRANSFER THROUGH ALUMINUM OXIDE CERAMIC INSULATED METAL BASE PLATE; CHIP SOLDERED ON DIRECT COPPER BONDED AI2O3 CERAMIC; THYRISTOR WITH CENTER GATE
PART NAME ASSIGNED BY CONTROLLING AGENCYTHYRISTOR MODULE