NSN 5962-00-091-1383
Part Details | MEMORY MICROCIRCUIT
5962-00-091-1383 A circuit designed to store information and/or coded instructions. Item has pins or other connections to install in a computer or computing device. Does not include magnetic drums, tapes, punched cards or the like. For items that have portable type connections see MEMORY, PORTABLE, SOLID STATE.
Alternate Parts: ROMPROM FAMILY 058, ROM/PROM FAMILY 058, 61912813, 619128-13, 5962-00-091-1383, 00-091-1383, 5962000911383, 000911383
Supply Group (FSG) | NSN Assigned | NIIN | Item Name Code (INC) |
---|---|---|---|
59 | NOV 29, 1972 | 00-091-1383 | 41015 ( MICROCIRCUIT, MEMORY ) |
REFERENCE DRAWINGS & PICTURES
Cross Reference | NSN 5962-00-091-1383
Part Number | Cage Code | Manufacturer |
---|---|---|
ROM/PROM FAMILY 058 | 16236 | DLA LAND AND MARITIMEDBA ENGINEERING AND TECHNICAL |
619128-13 | 37695 | RAYTHEON COMPANYDBA RAYTHEON |
Technical Data | NSN 5962-00-091-1383
Characteristic | Specifications |
---|---|
OUTPUT LOGIC FORM | CURRENT-MODE LOGIC |
INPUT CIRCUIT PATTERN | 6 INPUT |
VOLTAGE RATING AND TYPE PER CHARACTERISTIC | ACV60.0 VOLTS MAXIMUM |
TIME RATING PER CHACTERISTIC | AEE20.00 NANOSECONDS MAXIMUM |
MEMORY DEVICE TYPE | DIODE MATRIX |
OPERATING TEMP RANGE | -55.0 TO +125.0 DEG CELSIUS |
TERMINAL TYPE AND QUANTITY | 14 FLAT LEADS |
TERMINAL SURFACE TREATMENT | SOLDER |
INCLOSURE CONFIGURATION | FLAT PACK |
INCLOSURE MATERIAL | CERAMIC AND GLASS |
BODY LENGTH | 0.260 INCHES MAXIMUM |
BODY HEIGHT | 0.035 INCHES MINIMUM AND 0.045 INCHES MAXIMUM |
BODY WIDTH | 0.260 INCHES MAXIMUM |
MAXIMUM POWER DISSIPATION RATING | 450.0 MILLIWATTS |
STORAGE TEMP RANGE | -65.0 TO +150.0 DEG CELSIUS |
FEATURES PROVIDED | MONOLITHIC AND HERMETICALLY SEALED AND MEDIUM POWER |
TEST DATA DOCUMENT | 37695-619128 DRAWING (THIS IS THE BASIC GOVERNING DRAWING, SUCH AS A CONTRACTOR DRAWING, ORIGINAL EQUIPMENT MANUFACTURER DRAWING, ETC.; EXCLUDES ANY SPECIFICATION, STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING DRAWING) |