NSN 5962-01-128-6832
Part Details | HYBRID MICROCIRCUIT
5962-01-128-6832 A circuit in which one type of microcircuit is combined with some other type of microcircuit or with discrete components. For two microcircuits on a common mounting or on each other, see MICROCIRCUIT ASSEMBLY. For microcircuits having a complete independent memory function, see MICROCIRCUIT (1), MEMORY.
Alternate Parts: TS41381, TS-4138-1, 1040596, PS735031, PS73503-1, 2275375, 5962-01-128-6832, 01-128-6832, 5962011286832, 011286832
| Supply Group (FSG) | NSN Assigned | NIIN | Item Name Code (INC) |
|---|---|---|---|
| 59 | MAR 26, 1982 | 01-128-6832 | 41014 ( MICROCIRCUIT, HYBRID ) |
REFERENCE DRAWINGS & PICTURES
Cross Reference | NSN 5962-01-128-6832
| Part Number | Cage Code | Manufacturer |
|---|---|---|
| TS-4138-1 | 54485 | MICROSEMI CORP.- MASSACHUSETTSDBA MICROSEMI LAWRENCE |
| 1040596 | 00816 | PALOMAR PRODUCTS, INC. |
| PS73503-1 | 09344 | ROCKWELL COLLINS, INC.DBA RC DISPLAYS SYSTEMS |
| 2275375 | 16170 | TELEDYNE TECHNOLOGIES INCORPORATEDDBA TELEDYNE MICROELECTRONIC |
Technical Data | NSN 5962-01-128-6832
| Characteristic | Specifications |
|---|---|
| DESIGN FUNCTION AND QUANTITY | 1 CENTRAL PROCESSOR UNIT |
| VOLTAGE RATING AND TYPE PER CHARACTERISTIC | ACV7.0 VOLTS MAXIMUM |
| CURRENT RATING PER CHARACTERISTIC | BACHG385.30 MILLIAMPERES NOMINAL |
| TIME RATING PER CHACTERISTIC | NSCADT60.00 NANOSECONDS |
| OPERATING TEMP RANGE | -55.0 TO +125.0 DEG CELSIUS |
| TERMINAL TYPE AND QUANTITY | 44 PIN |
| TERMINAL SURFACE TREATMENT | SOLDER |
| INCLOSURE CONFIGURATION | LEADLESS FLAT PACK |
| INCLOSURE MATERIAL | CERAMIC |
| HYBRID TECHNOLOGY TYPE | MONOLITHIC |
| BODY LENGTH | 1.245 INCHES MINIMUM AND 1.255 INCHES MAXIMUM |
| BODY HEIGHT | 0.185 INCHES MAXIMUM |
| BODY WIDTH | 1.245 INCHES MINIMUM AND 1.255 INCHES MAXIMUM |
| STORAGE TEMP RANGE | -65.0 TO +150.0 DEG CELSIUS |
| FEATURES PROVIDED | HYBRID AND HERMETICALLY SEALED AND BURN IN AND W/CLOCK |
| TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |