NSN 5962-01-139-5771
Part Details | HYBRID MICROCIRCUIT
5962-01-139-5771 A circuit in which one type of microcircuit is combined with some other type of microcircuit or with discrete components. For two microcircuits on a common mounting or on each other, see MICROCIRCUIT ASSEMBLY. For microcircuits having a complete independent memory function, see MICROCIRCUIT (1), MEMORY.
Alternate Parts: LH0033CG, 34516701, 3451670-1, CTS0033ZB, 8001401ZX, 8001401ZC, 8001401ZB, 8001401ZB, 8001401ZA, 80014, ELH0033G883B, ELH0033G/883B, 158087892, 15-808789-2, G390549S1, 725000460, 725000-460, 60887031, 6088703-1, MSK0033B, LH0033CG, SH78134, SH72042B, SH14904, LM0033G883B, LH0033G883B, LH0033G/883B, LH0033CH, LH0033CG883C, LH0033CG883, LH0033CG/883, 8001401ZX, CH78134, 5595024, 10138243, S16100442, S161-00442, 4017224533, 4017224-533, 725016A05851, 725016A0585-1, 725000105, 725000-105, 5709301, 570930-1, 13038599, FLH0033G883, FLH0033G/883, TP003383, TP0033-83, 1017394C4, 13038599, 13038599, 13038599, 5962-01-139-5771, 01-139-5771, 5962011395771, 011395771
| Supply Group (FSG) | NSN Assigned | NIIN | Item Name Code (INC) |
|---|---|---|---|
| 59 | OCT 04, 1982 | 01-139-5771 | 41014 ( MICROCIRCUIT, HYBRID ) |
REFERENCE DRAWINGS & PICTURES
Cross Reference | NSN 5962-01-139-5771
| Part Number | Cage Code | Manufacturer |
|---|---|---|
| LH0033CG | 33472 | BOEING COMPANY, THEDBA BOEING |
| 3451670-1 | 93346 | COBHAM ADVANCED ELECTRONIC SOLUTIONSINC. |
| CTS0033ZB | 23223 | CTS MICROELECTRONICS |
| 8001401ZX | 67268 | DLA LAND AND MARITIMEDBA ENGINEERING AND TECHNICAL |
| 8001401ZC | 67268 | DLA LAND AND MARITIMEDBA ENGINEERING AND TECHNICAL |
| 8001401ZB | 67268 | DLA LAND AND MARITIMEDBA ENGINEERING AND TECHNICAL |
| 8001401ZB | 16236 | DLA LAND AND MARITIMEDBA ENGINEERING AND TECHNICAL |
| 8001401ZA | 67268 | DLA LAND AND MARITIMEDBA ENGINEERING AND TECHNICAL |
| 80014 | 67268 | DLA LAND AND MARITIMEDBA ENGINEERING AND TECHNICAL |
| ELH0033G/883B | 64762 | ELANTEC INC |
| 15-808789-2 | 07397 | GENERAL DYNAMICS ADVANCEDINFORMATION SYSTEMS INC. |
| G390549S1 | 24930 | HARRIS CORPORATIONDBA ELECTRONIC SYSTEMS, RADAR |
| 725000-460 | 90536 | LOCKHEED MARTIN CORPORATIONDBA LOCKHEED MARTIN |
| 6088703-1 | 03640 | LOCKHEED MARTIN CORPORATIONDBA LOCKHEED MARTIN |
| MSK0033B | 51651 | M. S. KENNEDY CORP. |
| LH0033CG | 81349 | MILITARY SPECIFICATIONSPROMULGATED BY MILITARY |
| SH78134 | 27014 | NATIONAL SEMICONDUCTOR CORPORATION |
| SH72042B | 27014 | NATIONAL SEMICONDUCTOR CORPORATION |
| SH14904 | 27014 | NATIONAL SEMICONDUCTOR CORPORATION |
| LM0033G883B | 27014 | NATIONAL SEMICONDUCTOR CORPORATION |
| LH0033G/883B | 27014 | NATIONAL SEMICONDUCTOR CORPORATION |
| LH0033CH | 27014 | NATIONAL SEMICONDUCTOR CORPORATION |
| LH0033CG883C | 27014 | NATIONAL SEMICONDUCTOR CORPORATION |
| LH0033CG/883 | 27014 | NATIONAL SEMICONDUCTOR CORPORATION |
| 8001401ZX | 27014 | NATIONAL SEMICONDUCTOR CORPORATION |
| CH78134 | 27014 | NATIONAL SEMICONDUCTOR CORPORATION |
| 5595024 | 53711 | NAVAL SEA SYSTEMS COMMAND |
| 10138243 | A486G | NIMIKKEISTOKESKUS NCB FINLAND |
| S161-00442 | 95542 | NORTHROP GRUMMAN SYSTEMS CORPORATION |
| 4017224-533 | 07817 | P.J. NOYES COMPANY, INC. |
| 725016A0585-1 | 87990 | QUARTERMASTER GENERAL |
| 725000-105 | 05869 | RAYTHEON COMPANYDBA RAYTHEON |
| 570930-1 | 49956 | RAYTHEON COMPANYDBA RAYTHEON |
| 13038599 | 05716 | RAYTHEON COMPANYDBA RAYTHEON |
| FLH0033G/883 | 27851 | SPECTRUM MICROWAVE, INC.DIV API TECHNOLOGIES - SPECTRUM |
| TP0033-83 | 29832 | TELEDYNE INCTELEDYNE COMPONENTS DIV |
| 1017394C4 | K0233 | THALES OPTRONICS LIMITED |
| 13038599 | 9X991 | TRICELIN CORP DBA T C ELECTRONICS |
| 13038599 | 18876 | U S ARMY AVIATION AND MISSILECOMMAND |
| 13038599 | 29056 | WOODARD ELECTRIC, INC. |
Technical Data | NSN 5962-01-139-5771
| Characteristic | Specifications |
|---|---|
| DESIGN FUNCTION AND QUANTITY | 1 AMPLIFIER, BUFFER |
| INPUT CIRCUIT PATTERN | 2 INPUT |
| VOLTAGE RATING AND TYPE PER CHARACTERISTIC | ACV40.0 VOLTS MAXIMUM |
| OPERATING TEMP RANGE | -55.0 TO +125.0 DEG CELSIUS |
| TERMINAL TYPE AND QUANTITY | 12 PIN |
| TERMINAL SURFACE TREATMENT | SOLDER |
| INCLOSURE CONFIGURATION | CAN |
| INCLOSURE MATERIAL | METAL |
| HYBRID TECHNOLOGY TYPE | FILM |
| BODY OUTSIDE DIAMETER | 0.595 INCHES MINIMUM AND 0.605 INCHES MAXIMUM |
| BODY HEIGHT | 0.148 INCHES MINIMUM AND 0.181 INCHES MAXIMUM |
| MAXIMUM POWER DISSIPATION RATING | 1.5 WATTS |
| STORAGE TEMP RANGE | -65.0 TO +150.0 DEG CELSIUS |
| FEATURES PROVIDED | HERMETICALLY SEALED AND HIGH SPEED AND HYBRID AND THICK FILM AND W/VOLTAGE FOLLOW |
| TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| END ITEM IDENTIFICATION | TRANSM ALQ99 06129 |