NSN 5962-01-157-9899

Part Details | MEMORY MICROCIRCUIT

5962-01-157-9899 A circuit designed to store information and/or coded instructions. Item has pins or other connections to install in a computer or computing device. Does not include magnetic drums, tapes, punched cards or the like. For items that have portable type connections see MEMORY, PORTABLE, SOLID STATE.

Alternate Parts: DH75703605, DH75703-605, 93453 FMQB, HR10985, B2052605, B2052-605, B2052605, B2052-605, 53531F883B, 5353-1F/883B, 53S441F, 19119, 932883605, 932883-605, 5962-01-157-9899, 01-157-9899, 5962011579899, 011579899

Supply Group (FSG) NSN Assigned NIIN Item Name Code (INC)
59JUL 14, 198301-157-989941015 ( MICROCIRCUIT, MEMORY )
REFERENCE DRAWINGS & PICTURES
Cross Reference | NSN 5962-01-157-9899
Part Number Cage Code Manufacturer
DH75703-60534335ADVANCED MICRO DEVICES, INC.DBA A M D
93453 FMQB07263FAIRCHILD SEMICONDUCTOR CORP
HR1098507263FAIRCHILD SEMICONDUCTOR CORP
B2052-6051MY79INTERSIL COMMUNICATIONS INC.
B2052-60534371INTERSIL CORPORATIONDIV NA
5353-1F/883B50364MMI/AMD
53S441F50364MMI/AMD
1911950364MMI/AMD
932883-60582577RAYTHEON COMPANYDBA RAYTHEON
Technical Data | NSN 5962-01-157-9899
Characteristic Specifications
OUTPUT LOGIC FORM TRANSISTOR-TRANSISTOR LOGIC
INPUT CIRCUIT PATTERN 12 INPUT
VOLTAGE RATING AND TYPE PER CHARACTERISTICACV5.5 VOLTS MAXIMUM
MEMORY DEVICE TYPE ROM
OPERATING TEMP RANGE-55.0 TO +125.0 DEG CELSIUS
TERMINAL TYPE AND QUANTITY18 FLAT LEADS
TERMINAL SURFACE TREATMENT SOLDER
INCLOSURE CONFIGURATION FLAT PACK
INCLOSURE MATERIAL CERAMIC
BODY LENGTH0.355 INCHES MINIMUM AND 0.400 INCHES MAXIMUM
BODY HEIGHT0.090 INCHES MAXIMUM
BODY WIDTH0.355 INCHES MINIMUM AND 0.400 INCHES MAXIMUM
MAXIMUM POWER DISSIPATION RATING1085.0 MILLIWATTS
STORAGE TEMP RANGE-65.0 TO +150.0 DEG CELSIUS
FEATURES PROVIDED HERMETICALLY SEALED AND PROGRAMMABLE AND BIPOLAR
TEST DATA DOCUMENT96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).