NSN 5962-01-159-7882
Part Details | MEMORY MICROCIRCUIT
5962-01-159-7882 A circuit designed to store information and/or coded instructions. Item has pins or other connections to install in a computer or computing device. Does not include magnetic drums, tapes, punched cards or the like. For items that have portable type connections see MEMORY, PORTABLE, SOLID STATE.
Alternate Parts: 3329621, 332962-1, ROMPROM HEAD 021, ROM/PROM HEAD 021, HM176102, HM1-7610-2, 7610, 59623820301BEB, 5962-3820301BEB, 59623820301BEA, 5962-3820301BEA, 3329621, 332962-1, M3851020301BEB, M38510/20301BEB, M3851020301BEA, M38510/20301BEA, MILM38510203, MIL-M-38510/203, JM3851020301BEB, JM38510/20301BEB, 59623820301BEX, 5962-3820301BEX, 5300J, 53001J, 5300-1J, MM6300J, MM5300J, DM54S387J833B, 5187079, 708218001, 708218-001, 5962-01-159-7882, 01-159-7882, 5962011597882, 011597882
| Supply Group (FSG) | NSN Assigned | NIIN | Item Name Code (INC) |
|---|---|---|---|
| 59 | AUG 13, 1983 | 01-159-7882 | 41015 ( MICROCIRCUIT, MEMORY ) |
REFERENCE DRAWINGS & PICTURES
Cross Reference | NSN 5962-01-159-7882
| Part Number | Cage Code | Manufacturer |
|---|---|---|
| 332962-1 | 80249 | BAE SYSTEMS INFORMATION ANDELECTRONIC SYSTEMS INTEGRATION INC. |
| ROM/PROM HEAD 021 | 16236 | DLA LAND AND MARITIMEDBA ENGINEERING AND TECHNICAL |
| HM1-7610-2 | 34371 | INTERSIL CORPORATIONDIV NA |
| 7610 | 34371 | INTERSIL CORPORATIONDIV NA |
| 5962-3820301BEB | 81349 | MILITARY SPECIFICATIONSPROMULGATED BY MILITARY |
| 5962-3820301BEA | 81349 | MILITARY SPECIFICATIONSPROMULGATED BY MILITARY |
| 332962-1 | 81349 | MILITARY SPECIFICATIONSPROMULGATED BY MILITARY |
| M38510/20301BEB | 81349 | MILITARY SPECIFICATIONSPROMULGATED BY MILITARY |
| M38510/20301BEA | 81349 | MILITARY SPECIFICATIONSPROMULGATED BY MILITARY |
| MIL-M-38510/203 | 81349 | MILITARY SPECIFICATIONSPROMULGATED BY MILITARY |
| JM38510/20301BEB | 81349 | MILITARY SPECIFICATIONSPROMULGATED BY MILITARY |
| 5962-3820301BEX | 81349 | MILITARY SPECIFICATIONSPROMULGATED BY MILITARY |
| 5300J | 50364 | MMI/AMD |
| 5300-1J | 50364 | MMI/AMD |
| MM6300J | 50364 | MMI/AMD |
| MM5300J | 50364 | MMI/AMD |
| DM54S387J833B | 27014 | NATIONAL SEMICONDUCTOR CORPORATION |
| 5187079 | 59661 | SYNTEGRA / USA/ INCCOMPUTER PARTS AND SUPPLIES |
| 708218-001 | 8P525 | WATKINS JOHNSON CO |
Technical Data | NSN 5962-01-159-7882
| Characteristic | Specifications |
|---|---|
| OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
| INPUT CIRCUIT PATTERN | 10 INPUT |
| VOLTAGE RATING AND TYPE PER CHARACTERISTIC | ABC7.0 VOLTS MAXIMUM |
| TIME RATING PER CHACTERISTIC | NSCAEE30.00 NANOSECONDS AND NSCAED30.00 NANOSECONDS |
| MEMORY DEVICE TYPE | PROM |
| MEMORY CAPACITY | UNKNOWN |
| OPERATING TEMP RANGE | -55.0 TO +125.0 DEG CELSIUS |
| TERMINAL TYPE AND QUANTITY | 16 PRINTED CIRCUIT |
| TERMINAL SURFACE TREATMENT | SOLDER |
| INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| INCLOSURE MATERIAL | CERAMIC AND GLASS |
| CASE OUTLINE SOURCE AND DESIGNATOR | D-2 MIL-M-38510 |
| BODY LENGTH | 0.840 INCHES MAXIMUM |
| BODY HEIGHT | 0.185 INCHES MAXIMUM |
| BODY WIDTH | 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM |
| MAXIMUM POWER DISSIPATION RATING | 739.0 MILLIWATTS |
| STORAGE TEMP RANGE | -65.0 TO +150.0 DEG CELSIUS |
| FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND SCHOTTKY AND MONOLITHIC AND W/OPEN COLLECTOR |
| TEST DATA DOCUMENT | 81349-MIL-M-38510 SPECIFICATION (INCLUDES ENGINEERING TYPE BULLETINS, BROCHURES,ETC., THAT REFLECT SPECIFICATION TYPE DATA IN SPECIFICATION FORMAT; EXCLUDES COMMERCIAL CATALOGS, INDUSTRY DIRECTORIES, AND SIMILAR TRADE PUBLICATIONS, REFLECTING GENERAL TYPE DATA ON CERTAIN ENVIRONMENTAL AND PERFORMANCE REQUIREMENTS AND TEST CONDITIONS THAT ARE SHOWN AS "TYPICAL", "AVERAGE", "NOMINAL", ETC.). |
| SPECIFICATION/STANDARD DATA | 81349-MIL-M-38510 TO 203 GOVERNMENT SPECIFICATION |