NSN 5962-01-163-4168
Part Details | MEMORY MICROCIRCUIT
5962-01-163-4168 A circuit designed to store information and/or coded instructions. Item has pins or other connections to install in a computer or computing device. Does not include magnetic drums, tapes, punched cards or the like. For items that have portable type connections see MEMORY, PORTABLE, SOLID STATE.
Alternate Parts: 0008002348, 000-8002-348, ROMPROM, ROM/PROM, 93453DC, D36252, D3625-2, HM176435, HM1-7643-5, HM176435, HM1-7643-5, 401431201, 4014312-01, MM63531J, MM6353-1J, N82S137F, SK010296, 4014726124, 4014726-124, 401431201, 4014312-01, SN74S476J, 5962-01-163-4168, 01-163-4168, 5962011634168, 011634168
| Supply Group (FSG) | NSN Assigned | NIIN | Item Name Code (INC) |
|---|---|---|---|
| 59 | OCT 04, 1983 | 01-163-4168 | 41015 ( MICROCIRCUIT, MEMORY ) |
REFERENCE DRAWINGS & PICTURES
Cross Reference | NSN 5962-01-163-4168
| Part Number | Cage Code | Manufacturer |
|---|---|---|
| 000-8002-348 | 94756 | BOEING COMPANY, THEDBA BOEING |
| ROM/PROM | 16236 | DLA LAND AND MARITIMEDBA ENGINEERING AND TECHNICAL |
| 93453DC | 07263 | FAIRCHILD SEMICONDUCTOR CORP |
| D3625-2 | 34649 | INTEL CORP SALES OFFICE |
| HM1-7643-5 | 1MY79 | INTERSIL COMMUNICATIONS INC. |
| HM1-7643-5 | 34371 | INTERSIL CORPORATIONDIV NA |
| 4014312-01 | 1PQF4 | L3 TECHNOLOGIES, INC.DBA LINK SIMULATION & TRAINING |
| MM6353-1J | 50364 | MMI/AMD |
| N82S137F | 18324 | PHILIPS SEMICONDUCTORS INC |
| SK010296 | 36378 | RAYTHEON TECHNICAL SERVICES COMPANY |
| 4014726-124 | 36378 | RAYTHEON TECHNICAL SERVICES COMPANY |
| 4014312-01 | 36378 | RAYTHEON TECHNICAL SERVICES COMPANY |
| SN74S476J | 01295 | TEXAS INSTRUMENTS INCORPORATEDDBA TEXAS INSTRUMENTS |
Technical Data | NSN 5962-01-163-4168
| Characteristic | Specifications |
|---|---|
| OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
| INPUT CIRCUIT PATTERN | 12 INPUT |
| VOLTAGE RATING AND TYPE PER CHARACTERISTIC | ACV5.5 VOLTS MAXIMUM |
| TIME RATING PER CHACTERISTIC | NSCAEE30.00 NANOSECONDS AND NSCAED30.00 NANOSECONDS |
| MEMORY DEVICE TYPE | ROM |
| MEMORY CAPACITY | UNKNOWN |
| OPERATING TEMP RANGE | +0.0 TO +75.0 DEG CELSIUS |
| TERMINAL TYPE AND QUANTITY | 18 PRINTED CIRCUIT |
| TERMINAL SURFACE TREATMENT | SOLDER |
| INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| INCLOSURE MATERIAL | CERAMIC AND GLASS |
| BODY LENGTH | 0.880 INCHES MINIMUM AND 0.930 INCHES MAXIMUM |
| BODY HEIGHT | 0.155 INCHES MINIMUM AND 0.175 INCHES MAXIMUM |
| BODY WIDTH | 0.265 INCHES MINIMUM AND 0.300 INCHES MAXIMUM |
| STORAGE TEMP RANGE | -65.0 TO +150.0 DEG CELSIUS |
| FEATURES PROVIDED | HERMETICALLY SEALED AND PROGRAMMABLE AND BIPOLAR AND MONOLITHIC |