NSN 5962-01-229-1066

Part Details | MEMORY MICROCIRCUIT

5962-01-229-1066 A circuit designed to store information and/or coded instructions. Item has pins or other connections to install in a computer or computing device. Does not include magnetic drums, tapes, punched cards or the like. For items that have portable type connections see MEMORY, PORTABLE, SOLID STATE.

Alternate Parts: 8200802KA, ROMPROM FAMILY 248, ROM/PROM FAMILY 248, 10133942, 50591030076, 5059103-00-76, 50591030075, 5059103-00-75, 50591030070, 5059103-00-70, H990301003B, H990301-003B, 5962-01-229-1066, 01-229-1066, 5962012291066, 012291066

Supply Group (FSG) NSN Assigned NIIN Item Name Code (INC)
59MAR 26, 198601-229-106641015 ( MICROCIRCUIT, MEMORY )
REFERENCE DRAWINGS & PICTURES
Cross Reference | NSN 5962-01-229-1066
Part Number Cage Code Manufacturer
8200802KA67268DLA LAND AND MARITIMEDBA ENGINEERING AND TECHNICAL
ROM/PROM FAMILY 24816236DLA LAND AND MARITIMEDBA ENGINEERING AND TECHNICAL
10133942A486GNIMIKKEISTOKESKUS NCB FINLAND
5059103-00-7682577RAYTHEON COMPANYDBA RAYTHEON
5059103-00-7582577RAYTHEON COMPANYDBA RAYTHEON
5059103-00-7082577RAYTHEON COMPANYDBA RAYTHEON
H990301-003B82577RAYTHEON COMPANYDBA RAYTHEON
Technical Data | NSN 5962-01-229-1066
Characteristic Specifications
VOLTAGE RATING AND TYPE PER CHARACTERISTICACV5.0 VOLTS NOMINAL
TIME RATING PER CHACTERISTICNSCADW55.00 NANOSECONDS
MEMORY DEVICE TYPE ROM
OPERATING TEMP RANGE-55.0 TO +125.0 DEG CELSIUS
TERMINAL TYPE AND QUANTITY24 FLAT LEADS
TERMINAL SURFACE TREATMENT SOLDER
INCLOSURE CONFIGURATION FLAT PACK
INCLOSURE MATERIAL CERAMIC
PART NAME ASSIGNED BY CONTROLLING AGENCYPROGRAMMED, 4096X8
FEATURES PROVIDED HERMETICALLY SEALED AND PROGRAMMED AND ELECTROSTATIC SENSITIVE