NSN 5962-01-233-2299

Part Details | MEMORY MICROCIRCUIT

5962-01-233-2299 A circuit designed to store information and/or coded instructions. Item has pins or other connections to install in a computer or computing device. Does not include magnetic drums, tapes, punched cards or the like. For items that have portable type connections see MEMORY, PORTABLE, SOLID STATE.

Alternate Parts: ROMPROM, ROM/PROM, 16067403, 160674-03, MR2864AB35, MR2864A/B-35, X2864AEMB35C6148, X2864AEMB-35/C6148, X2864AC6148, 5962-01-233-2299, 01-233-2299, 5962012332299, 012332299

Supply Group (FSG) NSN Assigned NIIN Item Name Code (INC)
59MAY 28, 198601-233-229941015 ( MICROCIRCUIT, MEMORY )
REFERENCE DRAWINGS & PICTURES
Cross Reference | NSN 5962-01-233-2299
Part Number Cage Code Manufacturer
ROM/PROM16236DLA LAND AND MARITIMEDBA ENGINEERING AND TECHNICAL
160674-0335351GE AVIATION SYSTEMS LLC
MR2864A/B-3534649INTEL CORP SALES OFFICE
X2864AEMB-35/C614860395XICOR INC
X2864AC614860395XICOR INC
Technical Data | NSN 5962-01-233-2299
Characteristic Specifications
OUTPUT LOGIC FORM N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC
INPUT CIRCUIT PATTERN 24 INPUT
VOLTAGE RATING AND TYPE PER CHARACTERISTICACVM1.0 VOLTS MINIMUM AND ACV6.0 VOLTS MAXIMUM
TIME RATING PER CHACTERISTICNSCAEE350.00 NANOSECONDS AND NSCAED350.00 NANOSECONDS
MEMORY DEVICE TYPE ROM
WORD QUANTITY8192
BIT QUANTITY65536
OPERATING TEMP RANGE-55.0 TO +125.0 DEG CELSIUS
TERMINAL TYPE AND QUANTITY32 LEADLESS
TERMINAL SURFACE TREATMENT SOLDER
INCLOSURE CONFIGURATION LEADLESS FLAT PACK
INCLOSURE MATERIAL CERAMIC
BODY LENGTH0.560 INCHES MAXIMUM
BODY HEIGHT0.105 INCHES MAXIMUM
BODY WIDTH0.458 INCHES MAXIMUM
MAXIMUM POWER DISSIPATION RATING770.0 MILLIWATTS
STORAGE TEMP RANGE-65.0 TO +150.0 DEG CELSIUS
FEATURES PROVIDED ELECTROSTATIC SENSITIVE AND HERMETICALLY SEALED AND MONOLITHIC AND ERASABLE AND PROGRAMMABLE AND W/ENABLE
TEST DATA DOCUMENT96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).