NSN 5962-01-236-9487

Part Details | MEMORY MICROCIRCUIT

5962-01-236-9487 A circuit designed to store information and/or coded instructions. Item has pins or other connections to install in a computer or computing device. Does not include magnetic drums, tapes, punched cards or the like. For items that have portable type connections see MEMORY, PORTABLE, SOLID STATE.

Alternate Parts: ROMPROM FAMILY 007, ROM/PROM FAMILY 007, HM176858, HM1-7685-8, S82S185F883C, S82S185F/883C, 72292250, 722922-50, 467301, 46730-1, 5962-01-236-9487, 01-236-9487, 5962012369487, 012369487

Supply Group (FSG) NSN Assigned NIIN Item Name Code (INC)
59JUL 24, 198601-236-948741015 ( MICROCIRCUIT, MEMORY )
REFERENCE DRAWINGS & PICTURES
Cross Reference | NSN 5962-01-236-9487
Part Number Cage Code Manufacturer
ROM/PROM FAMILY 00716236DLA LAND AND MARITIMEDBA ENGINEERING AND TECHNICAL
HM1-7685-834371INTERSIL CORPORATIONDIV NA
S82S185F/883C18324PHILIPS SEMICONDUCTORS INC
722922-5005869RAYTHEON COMPANYDBA RAYTHEON
46730-105869RAYTHEON COMPANYDBA RAYTHEON
Technical Data | NSN 5962-01-236-9487
Characteristic Specifications
OUTPUT LOGIC FORM TRANSISTOR-TRANSISTOR LOGIC
INPUT CIRCUIT PATTERN 12 INPUT
VOLTAGE RATING AND TYPE PER CHARACTERISTICACV7.0 VOLTS MAXIMUM
TIME RATING PER CHACTERISTICNSCAEE60.00 NANOSECONDS AND NSCAED60.00 NANOSECONDS
MEMORY DEVICE TYPE ROM
OPERATING TEMP RANGE-55.0 TO +125.0 DEG CELSIUS
TERMINAL TYPE AND QUANTITY18 PRINTED CIRCUIT
TERMINAL SURFACE TREATMENT SOLDER
INCLOSURE CONFIGURATION DUAL-IN-LINE
INCLOSURE MATERIAL CERAMIC
BODY LENGTH0.925 INCHES MAXIMUM
BODY HEIGHT0.175 INCHES MAXIMUM
BODY WIDTH0.302 INCHES MAXIMUM
MAXIMUM POWER DISSIPATION RATING409.6 MILLIWATTS
STORAGE TEMP RANGE-65.0 TO +150.0 DEG CELSIUS
FEATURES PROVIDED HERMETICALLY SEALED AND BURN IN AND BIPOLAR AND PROGRAMMABLE AND W/ENABLE
TEST DATA DOCUMENT96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).