NSN 5962-01-238-2671
Part Details | MEMORY MICROCIRCUIT
5962-01-238-2671 A circuit designed to store information and/or coded instructions. Item has pins or other connections to install in a computer or computing device. Does not include magnetic drums, tapes, punched cards or the like. For items that have portable type connections see MEMORY, PORTABLE, SOLID STATE.
Alternate Parts: 4772060001, 477-2060-001, ROMPROM, ROM/PROM, HE31080D005, HE3108-0-D-005, HE31080D001, HE3108-0-D-001, HE31080D, HE3108-0-D, HC3108, 5962-01-238-2671, 01-238-2671, 5962012382671, 012382671
| Supply Group (FSG) | NSN Assigned | NIIN | Item Name Code (INC) |
|---|---|---|---|
| 59 | AUG 13, 1986 | 01-238-2671 | 41015 ( MICROCIRCUIT, MEMORY ) |
REFERENCE DRAWINGS & PICTURES
Cross Reference | NSN 5962-01-238-2671
| Part Number | Cage Code | Manufacturer |
|---|---|---|
| 477-2060-001 | 94756 | BOEING COMPANY, THEDBA BOEING |
| ROM/PROM | 16236 | DLA LAND AND MARITIMEDBA ENGINEERING AND TECHNICAL |
| HE3108-0-D-005 | 55267 | RAYTHEON COMPANYDBA RAYTHEON |
| HE3108-0-D-001 | 55267 | RAYTHEON COMPANYDBA RAYTHEON |
| HE3108-0-D | 55267 | RAYTHEON COMPANYDBA RAYTHEON |
| HC3108 | 55267 | RAYTHEON COMPANYDBA RAYTHEON |
Technical Data | NSN 5962-01-238-2671
| Characteristic | Specifications |
|---|---|
| OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| INPUT CIRCUIT PATTERN | 13 INPUT |
| VOLTAGE RATING AND TYPE PER CHARACTERISTIC | ACVM0.3 VOLTS MINIMUM AND ACV18.0 VOLTS MAXIMUM |
| MEMORY DEVICE TYPE | ROM |
| TERMINAL TYPE AND QUANTITY | 24 PRINTED CIRCUIT |
| TERMINAL SURFACE TREATMENT | SOLDER |
| INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| INCLOSURE MATERIAL | CERAMIC |
| BODY LENGTH | 1.260 INCHES MAXIMUM |
| BODY HEIGHT | 0.165 INCHES MAXIMUM |
| BODY WIDTH | 0.600 INCHES MAXIMUM |
| STORAGE TEMP RANGE | -65.0 TO +150.0 DEG CELSIUS |
| FEATURES PROVIDED | HERMETICALLY SEALED AND ERASABLE AND PROGRAMMABLE AND W/ENABLE |