NSN 5962-01-259-2035

Part Details | MEMORY MICROCIRCUIT

5962-01-259-2035 A circuit designed to store information and/or coded instructions. Item has pins or other connections to install in a computer or computing device. Does not include magnetic drums, tapes, punched cards or the like. For items that have portable type connections see MEMORY, PORTABLE, SOLID STATE.

Alternate Parts: F52001708, F17006404, HM6264LP12, HM6264LP-12, IDT7M864L120CB, 725004944, 725004-944, F52001708, F17006404, 5962-01-259-2035, 01-259-2035, 5962012592035, 012592035

Supply Group (FSG) NSN Assigned NIIN Item Name Code (INC)
59JUL 14, 198701-259-203541015 ( MICROCIRCUIT, MEMORY )
REFERENCE DRAWINGS & PICTURES
Cross Reference | NSN 5962-01-259-2035
Part Number Cage Code Manufacturer
F5200170865519FSG INC
F1700640465519FSG INC
HM6264LP-1252531HITACHI MAGNETICS CORPDIV OF HITACHI METALS INTERNATIONAL
IDT7M864L120CB61772INTEGRATED DEVICE TECHNOLOGY INC
725004-94405869RAYTHEON COMPANYDBA RAYTHEON
F520017086Z076WESPERCORP FSG INC
F170064046Z076WESPERCORP FSG INC
Technical Data | NSN 5962-01-259-2035
Characteristic Specifications
OUTPUT LOGIC FORM COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
INPUT CIRCUIT PATTERN 23 INPUT
VOLTAGE RATING AND TYPE PER CHARACTERISTICACV0.5 VOLTS MINIMUM AND ACV7.0 VOLTS MAXIMUM
TIME RATING PER CHACTERISTICNSCAEE120.00 NANOSECONDS AND NSCAED120.00 NANOSECONDS
MEMORY DEVICE TYPE RAM
OPERATING TEMP RANGE-55.0 TO +125.0 DEG CELSIUS
TERMINAL TYPE AND QUANTITY28 PRINTED CIRCUIT
TERMINAL SURFACE TREATMENT SOLDER
INCLOSURE CONFIGURATION DUAL-IN-LINE
INCLOSURE MATERIAL CERAMIC
BODY LENGTH1.400 INCHES NOMINAL
BODY HEIGHT0.280 INCHES MAXIMUM
BODY WIDTH0.594 INCHES NOMINAL
MAXIMUM POWER DISSIPATION RATING4.0 WATTS
STORAGE TEMP RANGE-65.0 TO +150.0 DEG CELSIUS
FEATURES PROVIDED LOW POWER AND HERMETICALLY SEALED AND HIGH SPEED AND MONOLITHIC
TEST DATA DOCUMENT96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).