NSN 5962-01-259-3906

Part Details | MEMORY MICROCIRCUIT

5962-01-259-3906 A circuit designed to store information and/or coded instructions. Item has pins or other connections to install in a computer or computing device. Does not include magnetic drums, tapes, punched cards or the like. For items that have portable type connections see MEMORY, PORTABLE, SOLID STATE.

Alternate Parts: ROMPROM, ROM/PROM, 704AS9892, S82S185I883B, S82S185I/883B, 8998921, 899892-1, 5962-01-259-3906, 01-259-3906, 5962012593906, 012593906

Supply Group (FSG) NSN Assigned NIIN Item Name Code (INC)
59JUL 17, 198701-259-390641015 ( MICROCIRCUIT, MEMORY )
REFERENCE DRAWINGS & PICTURES
Cross Reference | NSN 5962-01-259-3906
Part Number Cage Code Manufacturer
ROM/PROM16236DLA LAND AND MARITIMEDBA ENGINEERING AND TECHNICAL
704AS989230003NAVAL AIR SYSTEMS COMMAND MANAGEDORIGINAL DESIGN ACTIVITY NOT
S82S185I/883B18324PHILIPS SEMICONDUCTORS INC
899892-196214RAYTHEON COMPANYDBA RAYTHEON
Technical Data | NSN 5962-01-259-3906
Characteristic Specifications
OUTPUT LOGIC FORM TRANSISTOR-TRANSISTOR LOGIC
INPUT CIRCUIT PATTERN 12 INPUT
VOLTAGE RATING AND TYPE PER CHARACTERISTICACV7.0 VOLTS MAXIMUM
TIME RATING PER CHACTERISTICNSCAEE60.00 NANOSECONDS AND NSCAED60.00 NANOSECONDS
MEMORY DEVICE TYPE ROM
MEMORY CAPACITYUNKNOWN
OPERATING TEMP RANGE-55.0 TO +125.0 DEG CELSIUS
TERMINAL TYPE AND QUANTITY18 PRINTED CIRCUIT
TERMINAL SURFACE TREATMENT SOLDER
INCLOSURE CONFIGURATION DUAL-IN-LINE
INCLOSURE MATERIAL CERAMIC
BODY LENGTH0.930 INCHES MAXIMUM
BODY HEIGHT0.120 INCHES MAXIMUM
BODY WIDTH0.310 INCHES MAXIMUM
MAXIMUM POWER DISSIPATION RATING409.6 MILLIWATTS
STORAGE TEMP RANGE-65.0 TO +150.0 DEG CELSIUS
FEATURES PROVIDED HERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND BIPOLAR AND SCHOTTKY AND W/ENABLE
TEST DATA DOCUMENT96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).