NSN 5962-01-264-3009
Part Details | MEMORY MICROCIRCUIT
5962-01-264-3009 A circuit designed to store information and/or coded instructions. Item has pins or other connections to install in a computer or computing device. Does not include magnetic drums, tapes, punched cards or the like. For items that have portable type connections see MEMORY, PORTABLE, SOLID STATE.
Alternate Parts: AMPAL16R4AB2A, AMPAL16R4A/B2A, 81036102X, 81036102B, 81036102A, 81036, ROMPROM HEAD 254, ROM/PROM HEAD 254, PAL16R4AML883B, PAL16R4AML/883B, 10133855, G279788852, G279788-852, G279788852, G279788-852, PAL16R4AMFKB, 5962-01-264-3009, 01-264-3009, 5962012643009, 012643009
| Supply Group (FSG) | NSN Assigned | NIIN | Item Name Code (INC) |
|---|---|---|---|
| 59 | SEP 27, 1987 | 01-264-3009 | 41015 ( MICROCIRCUIT, MEMORY ) |
REFERENCE DRAWINGS & PICTURES
Cross Reference | NSN 5962-01-264-3009
| Part Number | Cage Code | Manufacturer |
|---|---|---|
| AMPAL16R4A/B2A | 34335 | ADVANCED MICRO DEVICES, INC.DBA A M D |
| 81036102X | 67268 | DLA LAND AND MARITIMEDBA ENGINEERING AND TECHNICAL |
| 81036102B | 67268 | DLA LAND AND MARITIMEDBA ENGINEERING AND TECHNICAL |
| 81036102A | 67268 | DLA LAND AND MARITIMEDBA ENGINEERING AND TECHNICAL |
| 81036 | 67268 | DLA LAND AND MARITIMEDBA ENGINEERING AND TECHNICAL |
| ROM/PROM HEAD 254 | 16236 | DLA LAND AND MARITIMEDBA ENGINEERING AND TECHNICAL |
| PAL16R4AML/883B | 50364 | MMI/AMD |
| 10133855 | A486G | NIMIKKEISTOKESKUS NCB FINLAND |
| G279788-852 | 49956 | RAYTHEON COMPANYDBA RAYTHEON |
| G279788-852 | 3B150 | RAYTHEON COMPANYDBA RAYTHEON |
| PAL16R4AMFKB | 01295 | TEXAS INSTRUMENTS INCORPORATEDDBA TEXAS INSTRUMENTS |
Technical Data | NSN 5962-01-264-3009
| Characteristic | Specifications |
|---|---|
| OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
| INPUT CIRCUIT PATTERN | 14 INPUT |
| VOLTAGE RATING AND TYPE PER CHARACTERISTIC | ACV7.0 VOLTS MAXIMUM |
| CURRENT RATING PER CHARACTERISTIC | GX100.00 MILLIAMPERES NOMINAL |
| TIME RATING PER CHACTERISTIC | NSCAEE30.00 NANOSECONDS AND NSCAED30.00 NANOSECONDS |
| MEMORY DEVICE TYPE | PAL |
| OPERATING TEMP RANGE | -55.0 TO +125.0 DEG CELSIUS |
| TERMINAL TYPE AND QUANTITY | 20 LEADLESS |
| TERMINAL SURFACE TREATMENT | SOLDER |
| INCLOSURE CONFIGURATION | LEADLESS FLAT PACK |
| INCLOSURE MATERIAL | CERAMIC AND GLASS |
| CASE OUTLINE SOURCE AND DESIGNATOR | C-2 MIL-M-38510 |
| BODY LENGTH | 0.358 INCHES MAXIMUM |
| BODY HEIGHT | 0.100 INCHES MAXIMUM |
| BODY WIDTH | 0.358 INCHES MAXIMUM |
| MAXIMUM POWER DISSIPATION RATING | 1.0 WATTS |
| STORAGE TEMP RANGE | -65.0 TO +150.0 DEG CELSIUS |
| FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND POSITIVE OUTPUTS |
| TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |