NSN 5962-01-264-3011
Part Details | MEMORY MICROCIRCUIT
5962-01-264-3011 A circuit designed to store information and/or coded instructions. Item has pins or other connections to install in a computer or computing device. Does not include magnetic drums, tapes, punched cards or the like. For items that have portable type connections see MEMORY, PORTABLE, SOLID STATE.
Alternate Parts: AMPAL16L8LB2A, AMPAL16L8L/B2A, 81036112X, 81036112B, 81036112A, 81036, PROMROM HEAD 213, PROM/ROM HEAD 213, 79495210013, 794952-1-0013, 7949521, 794952-1, PAL16L8A2ML883B, PAL16L8A-2ML/883B, PAL16L8A2MFKB, PAL16L8A-2MFKB, 5962-01-264-3011, 01-264-3011, 5962012643011, 012643011
| Supply Group (FSG) | NSN Assigned | NIIN | Item Name Code (INC) |
|---|---|---|---|
| 59 | SEP 27, 1987 | 01-264-3011 | 41015 ( MICROCIRCUIT, MEMORY ) |
REFERENCE DRAWINGS & PICTURES
Cross Reference | NSN 5962-01-264-3011
| Part Number | Cage Code | Manufacturer |
|---|---|---|
| AMPAL16L8L/B2A | 34335 | ADVANCED MICRO DEVICES, INC.DBA A M D |
| 81036112X | 67268 | DLA LAND AND MARITIMEDBA ENGINEERING AND TECHNICAL |
| 81036112B | 67268 | DLA LAND AND MARITIMEDBA ENGINEERING AND TECHNICAL |
| 81036112A | 67268 | DLA LAND AND MARITIMEDBA ENGINEERING AND TECHNICAL |
| 81036 | 67268 | DLA LAND AND MARITIMEDBA ENGINEERING AND TECHNICAL |
| PROM/ROM HEAD 213 | 16236 | DLA LAND AND MARITIMEDBA ENGINEERING AND TECHNICAL |
| 794952-1-0013 | 73030 | HAMILTON SUNDSTRAND CORPORATION |
| 794952-1 | 73030 | HAMILTON SUNDSTRAND CORPORATION |
| PAL16L8A-2ML/883B | 50364 | MMI/AMD |
| PAL16L8A-2MFKB | 01295 | TEXAS INSTRUMENTS INCORPORATEDDBA TEXAS INSTRUMENTS |
Technical Data | NSN 5962-01-264-3011
| Characteristic | Specifications |
|---|---|
| OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
| INPUT CIRCUIT PATTERN | 16 INPUT |
| VOLTAGE RATING AND TYPE PER CHARACTERISTIC | ACV7.0 VOLTS MAXIMUM |
| CURRENT RATING PER CHARACTERISTIC | GX100.00 MILLIAMPERES NOMINAL |
| TIME RATING PER CHACTERISTIC | NSCAEE50.00 NANOSECONDS AND NSCAED50.00 NANOSECONDS |
| MEMORY DEVICE TYPE | PAL |
| OPERATING TEMP RANGE | -55.0 TO +125.0 DEG CELSIUS |
| TERMINAL TYPE AND QUANTITY | 20 LEADLESS |
| TERMINAL SURFACE TREATMENT | SOLDER |
| INCLOSURE CONFIGURATION | LEADLESS FLAT PACK |
| INCLOSURE MATERIAL | CERAMIC AND GLASS |
| CASE OUTLINE SOURCE AND DESIGNATOR | C-2 MIL-M-38510 |
| BODY LENGTH | 0.358 INCHES MAXIMUM |
| BODY HEIGHT | 0.100 INCHES MAXIMUM |
| BODY WIDTH | 0.358 INCHES MAXIMUM |
| MAXIMUM POWER DISSIPATION RATING | 500.0 MILLIWATTS |
| STORAGE TEMP RANGE | -65.0 TO +150.0 DEG CELSIUS |
| FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND POSITIVE OUTPUTS |
| TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |