NSN 5962-01-273-4253

Part Details | MEMORY MICROCIRCUIT

5962-01-273-4253 A circuit designed to store information and/or coded instructions. Item has pins or other connections to install in a computer or computing device. Does not include magnetic drums, tapes, punched cards or the like. For items that have portable type connections see MEMORY, PORTABLE, SOLID STATE.

Alternate Parts: ROMPROM, ROM/PROM, 93Z511LMQB, 82S191AB3C, 82S191A/B3C, 82S191AB3A, 82S191A/B3A, 5962-01-273-4253, 01-273-4253, 5962012734253, 012734253

Supply Group (FSG) NSN Assigned NIIN Item Name Code (INC)
59FEB 25, 198801-273-425341015 ( MICROCIRCUIT, MEMORY )
REFERENCE DRAWINGS & PICTURES
Cross Reference | NSN 5962-01-273-4253
Part Number Cage Code Manufacturer
ROM/PROM16236DLA LAND AND MARITIMEDBA ENGINEERING AND TECHNICAL
93Z511LMQB27014NATIONAL SEMICONDUCTOR CORPORATION
82S191A/B3C18324PHILIPS SEMICONDUCTORS INC
82S191A/B3A18324PHILIPS SEMICONDUCTORS INC
Technical Data | NSN 5962-01-273-4253
Characteristic Specifications
OUTPUT LOGIC FORM TRANSISTOR-TRANSISTOR LOGIC
INPUT CIRCUIT PATTERN 14 INPUT
VOLTAGE RATING AND TYPE PER CHARACTERISTICACV7.0 VOLTS MAXIMUM
TIME RATING PER CHACTERISTICNSCAEE55.00 NANOSECONDS AND NSCAED55.00 NANOSECONDS
MEMORY DEVICE TYPE ROM
MEMORY CAPACITYUNKNOWN
OPERATING TEMP RANGE-55.0 TO +125.0 DEG CELSIUS
TERMINAL TYPE AND QUANTITY28 LEADLESS
TERMINAL SURFACE TREATMENT SOLDER
INCLOSURE CONFIGURATION LEADLESS FLAT PACK
INCLOSURE MATERIAL CERAMIC
BODY LENGTH0.450 INCHES NOMINAL
BODY HEIGHT0.070 INCHES MINIMUM AND 0.090 INCHES MAXIMUM
BODY WIDTH0.450 INCHES NOMINAL
MAXIMUM POWER DISSIPATION RATING500.0 MILLIWATTS
STORAGE TEMP RANGE-65.0 TO +150.0 DEG CELSIUS
FEATURES PROVIDED PROGRAMMABLE AND 3-STATE OUTPUT AND HIGH RELIABILITY AND LOW CURRENT
TEST DATA DOCUMENT96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).