NSN 5962-01-274-7052

Part Details | MEMORY MICROCIRCUIT

5962-01-274-7052 A circuit designed to store information and/or coded instructions. Item has pins or other connections to install in a computer or computing device. Does not include magnetic drums, tapes, punched cards or the like. For items that have portable type connections see MEMORY, PORTABLE, SOLID STATE.

Alternate Parts: AM2764A25BUC, AM2764A-25BUC, ROMPROM, ROM/PROM, 7950721, 795072-1, MR2764A25B, MR2764A-25/B, MR2764A25B, MR2764A-25/B, 5962-01-274-7052, 01-274-7052, 5962012747052, 012747052

Supply Group (FSG) NSN Assigned NIIN Item Name Code (INC)
59MAR 11, 198801-274-705241015 ( MICROCIRCUIT, MEMORY )
REFERENCE DRAWINGS & PICTURES
Cross Reference | NSN 5962-01-274-7052
Part Number Cage Code Manufacturer
AM2764A-25BUC34335ADVANCED MICRO DEVICES, INC.DBA A M D
ROM/PROM16236DLA LAND AND MARITIMEDBA ENGINEERING AND TECHNICAL
795072-173030HAMILTON SUNDSTRAND CORPORATION
MR2764A-25/B34649INTEL CORP SALES OFFICE
MR2764A-25/B3V146ROCHESTER ELECTRONICS, LLC
Technical Data | NSN 5962-01-274-7052
Characteristic Specifications
OUTPUT LOGIC FORM N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC
INPUT CIRCUIT PATTERN 16 INPUT
TIME RATING PER CHACTERISTICNSCAEE250.00 NANOSECONDS AND NSCAED250.00 NANOSECONDS
MEMORY DEVICE TYPE ROM
OPERATING TEMP RANGE-55.0 TO +125.0 DEG CELSIUS
TERMINAL TYPE AND QUANTITY32 LEADLESS
TERMINAL SURFACE TREATMENT SOLDER
INCLOSURE CONFIGURATION LEADLESS FLAT PACK
INCLOSURE MATERIAL CERAMIC
BODY LENGTH0.560 INCHES MAXIMUM
BODY HEIGHT0.120 INCHES MAXIMUM
BODY WIDTH0.458 INCHES MAXIMUM
STORAGE TEMP RANGE-65.0 TO +125.0 DEG CELSIUS
FEATURES PROVIDED HERMETICALLY SEALED AND BURN IN AND ULTRAVIOLET ERASABLE AND PROGRAMMABLE AND W/ENABLE AND ELECTROSTATIC SENSITIVE
TEST DATA DOCUMENT96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
END ITEM IDENTIFICATIONF/A-18 HORNET AIRCRAFT