NSN 5962-01-275-0836

Part Details | MEMORY MICROCIRCUIT

5962-01-275-0836 A circuit designed to store information and/or coded instructions. Item has pins or other connections to install in a computer or computing device. Does not include magnetic drums, tapes, punched cards or the like. For items that have portable type connections see MEMORY, PORTABLE, SOLID STATE.

Alternate Parts: AM2864AE300BUA, AM2864AE-300/BUA, ROMPROM, ROM/PROM, 7950731, 795073-1, 10133818, X2864BGMB, X2864BEMB, X2864AEMB, X286AEMB25, X286AEMB-25, 5962-01-275-0836, 01-275-0836, 5962012750836, 012750836

Supply Group (FSG) NSN Assigned NIIN Item Name Code (INC)
59MAR 17, 198801-275-083641015 ( MICROCIRCUIT, MEMORY )
REFERENCE DRAWINGS & PICTURES
Cross Reference | NSN 5962-01-275-0836
Part Number Cage Code Manufacturer
AM2864AE-300/BUA34335ADVANCED MICRO DEVICES, INC.DBA A M D
ROM/PROM16236DLA LAND AND MARITIMEDBA ENGINEERING AND TECHNICAL
795073-173030HAMILTON SUNDSTRAND CORPORATION
10133818A486GNIMIKKEISTOKESKUS NCB FINLAND
X2864BGMB60395XICOR INC
X2864BEMB60395XICOR INC
X2864AEMB60395XICOR INC
X286AEMB-2560395XICOR INC
Technical Data | NSN 5962-01-275-0836
Characteristic Specifications
OUTPUT LOGIC FORM N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC
INPUT CIRCUIT PATTERN 26 INPUT
VOLTAGE RATING AND TYPE PER CHARACTERISTICACV7.0 VOLTS MAXIMUM
MEMORY DEVICE TYPE PROM
OPERATING TEMP RANGE-55.0 TO +125.0 DEG CELSIUS
TERMINAL TYPE AND QUANTITY32 LEADLESS
TERMINAL SURFACE TREATMENT SOLDER
INCLOSURE CONFIGURATION LEADLESS FLAT PACK
INCLOSURE MATERIAL CERAMIC
BODY LENGTH0.560 INCHES MAXIMUM
BODY HEIGHT0.085 INCHES MAXIMUM
BODY WIDTH0.458 INCHES MAXIMUM
STORAGE TEMP RANGE-65.0 TO +150.0 DEG CELSIUS
FEATURES PROVIDED MONOLITHIC AND ELECTROSTATIC SENSITIVE AND ERASABLE
TEST DATA DOCUMENT73030-795073 DRAWING (THIS IS THE BASIC GOVERNING DRAWING, SUCH AS A CONTRACTOR DRAWING, ORIGINAL EQUIPMENT MANUFACTURER DRAWING, ETC.; EXCLUDES ANY SPECIFICATION, STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING DRAWING)