NSN 5962-01-287-0075

Part Details | MEMORY MICROCIRCUIT

5962-01-287-0075 A circuit designed to store information and/or coded instructions. Item has pins or other connections to install in a computer or computing device. Does not include magnetic drums, tapes, punched cards or the like. For items that have portable type connections see MEMORY, PORTABLE, SOLID STATE.

Alternate Parts: CY7C29135QMB, CY7C291-35QMB, ROMPROM FAMILY 126, ROM/PROM FAMILY 126, 83C097001, 83C097-001, 5188890001, 5188890-001, 5962-01-287-0075, 01-287-0075, 5962012870075, 012870075

Supply Group (FSG) NSN Assigned NIIN Item Name Code (INC)
59OCT 13, 198801-287-007541015 ( MICROCIRCUIT, MEMORY )
REFERENCE DRAWINGS & PICTURES
Cross Reference | NSN 5962-01-287-0075
Part Number Cage Code Manufacturer
CY7C291-35QMB65786CYPRESS SEMICONDUCTOR CORPORATIONDBA CYPRESS
ROM/PROM FAMILY 12616236DLA LAND AND MARITIMEDBA ENGINEERING AND TECHNICAL
83C097-0012J622SCI TECHNOLOGY, INC.
5188890-0012J622SCI TECHNOLOGY, INC.
Technical Data | NSN 5962-01-287-0075
Characteristic Specifications
OUTPUT LOGIC FORM COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
INPUT CIRCUIT PATTERN 14 INPUT
VOLTAGE RATING AND TYPE PER CHARACTERISTICACV7.0 VOLTS MAXIMUM
CURRENT RATING PER CHARACTERISTICBACHG120.00 MILLIAMPERES NOMINAL
TIME RATING PER CHACTERISTICNSCADT35.00 NANOSECONDS
MEMORY DEVICE TYPE PROM
OPERATING TEMP RANGE-55.0 TO +125.0 DEG CELSIUS
TERMINAL TYPE AND QUANTITY28 LEADLESS
TERMINAL SURFACE TREATMENT SOLDER
INCLOSURE CONFIGURATION LEADLESS FLAT PACK
INCLOSURE MATERIAL CERAMIC
BODY LENGTH0.458 INCHES MAXIMUM
BODY HEIGHT0.114 INCHES MAXIMUM
BODY WIDTH0.458 INCHES MAXIMUM
MAXIMUM POWER DISSIPATION RATING413.0 MILLIWATTS
STORAGE TEMP RANGE-65.0 TO +150.0 DEG CELSIUS
FEATURES PROVIDED HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND HIGH SPEED AND PROGRAMMED AND ELECTROSTATIC SENSITIVE
TEST DATA DOCUMENT96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).