NSN 5962-01-301-7007

Part Details | MEMORY MICROCIRCUIT

5962-01-301-7007 A circuit designed to store information and/or coded instructions. Item has pins or other connections to install in a computer or computing device. Does not include magnetic drums, tapes, punched cards or the like. For items that have portable type connections see MEMORY, PORTABLE, SOLID STATE.

Alternate Parts: ROMPROM, ROM/PROM, 7573225040, 7573225-040, 7571894205, 7571894-205, 53S3281BW883B, 5962-01-301-7007, 01-301-7007, 5962013017007, 013017007

Supply Group (FSG) NSN Assigned NIIN Item Name Code (INC)
59JUN 02, 198901-301-700741015 ( MICROCIRCUIT, MEMORY )
REFERENCE DRAWINGS & PICTURES
Cross Reference | NSN 5962-01-301-7007
Part Number Cage Code Manufacturer
ROM/PROM16236DLA LAND AND MARITIMEDBA ENGINEERING AND TECHNICAL
7573225-04013160GENERAL DYNAMICS LAND SYSTEMS INC.DBA WOODBRIDGE TECHNICAL CENTER
7571894-20513160GENERAL DYNAMICS LAND SYSTEMS INC.DBA WOODBRIDGE TECHNICAL CENTER
53S3281BW883B50364MMI/AMD
Technical Data | NSN 5962-01-301-7007
Characteristic Specifications
OUTPUT LOGIC FORM TRANSISTOR-TRANSISTOR LOGIC
INPUT CIRCUIT PATTERN 14 INPUT
VOLTAGE RATING AND TYPE PER CHARACTERISTICACV7.0 VOLTS MAXIMUM
TIME RATING PER CHACTERISTICNSCAEE60.00 NANOSECONDS AND NSCAED60.00 NANOSECONDS
MEMORY DEVICE TYPE ROM
MEMORY CAPACITYUNKNOWN
OPERATING TEMP RANGE-55.0 TO +125.0 DEG CELSIUS
TERMINAL TYPE AND QUANTITY14 FLAT LEADS
TERMINAL SURFACE TREATMENT SOLDER
INCLOSURE CONFIGURATION FLAT PACK
INCLOSURE MATERIAL CERAMIC
CASE OUTLINE SOURCE AND DESIGNATORF-6 MIL-M-38510
BODY LENGTH0.640 INCHES MAXIMUM
BODY HEIGHT0.045 INCHES MINIMUM AND 0.090 INCHES MAXIMUM
BODY WIDTH0.300 INCHES MINIMUM AND 0.420 INCHES MAXIMUM
STORAGE TEMP RANGE-65.0 TO +150.0 DEG CELSIUS
FEATURES PROVIDED ELECTROSTATIC SENSITIVE AND HERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND BIPOLAR
TEST DATA DOCUMENT96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).