NSN 5962-01-302-3422
Part Details | MEMORY MICROCIRCUIT
5962-01-302-3422 A circuit designed to store information and/or coded instructions. Item has pins or other connections to install in a computer or computing device. Does not include magnetic drums, tapes, punched cards or the like. For items that have portable type connections see MEMORY, PORTABLE, SOLID STATE.
Alternate Parts: AT22V1030LM883, AT22V10-30LM/883, PALC22V1030QMB, PALC22V10-30QMB, 596287539023X, 5962-87539023X, 596287539023B, 5962-87539023B, 596287539023A, 5962-87539023A, 59628753902B3X, 5962-8753902B3X, 59628753902B3B, 5962-8753902B3B, 59628753902B3A, 5962-8753902B3A, 596287539, 5962-87539, ROMPROM HEAD 185, ROM/PROM HEAD 185, 5962-01-302-3422, 01-302-3422, 5962013023422, 013023422
| Supply Group (FSG) | NSN Assigned | NIIN | Item Name Code (INC) |
|---|---|---|---|
| 59 | JUN 13, 1989 | 01-302-3422 | 41015 ( MICROCIRCUIT, MEMORY ) |
REFERENCE DRAWINGS & PICTURES
Cross Reference | NSN 5962-01-302-3422
| Part Number | Cage Code | Manufacturer |
|---|---|---|
| AT22V10-30LM/883 | 1FN41 | ATMEL CORPORATION |
| PALC22V10-30QMB | 65786 | CYPRESS SEMICONDUCTOR CORPORATIONDBA CYPRESS |
| 5962-87539023X | 67268 | DLA LAND AND MARITIMEDBA ENGINEERING AND TECHNICAL |
| 5962-87539023B | 67268 | DLA LAND AND MARITIMEDBA ENGINEERING AND TECHNICAL |
| 5962-87539023A | 67268 | DLA LAND AND MARITIMEDBA ENGINEERING AND TECHNICAL |
| 5962-8753902B3X | 67268 | DLA LAND AND MARITIMEDBA ENGINEERING AND TECHNICAL |
| 5962-8753902B3B | 67268 | DLA LAND AND MARITIMEDBA ENGINEERING AND TECHNICAL |
| 5962-8753902B3A | 67268 | DLA LAND AND MARITIMEDBA ENGINEERING AND TECHNICAL |
| 5962-87539 | 67268 | DLA LAND AND MARITIMEDBA ENGINEERING AND TECHNICAL |
| ROM/PROM HEAD 185 | 16236 | DLA LAND AND MARITIMEDBA ENGINEERING AND TECHNICAL |
Technical Data | NSN 5962-01-302-3422
| Characteristic | Specifications |
|---|---|
| INPUT CIRCUIT PATTERN | 22 INPUT |
| VOLTAGE RATING AND TYPE PER CHARACTERISTIC | ACV7.0 VOLTS MAXIMUM |
| TIME RATING PER CHACTERISTIC | NSCAEE30.00 NANOSECONDS AND NSCAED30.00 NANOSECONDS |
| MEMORY DEVICE TYPE | PAL |
| OPERATING TEMP RANGE | -55.0 TO +125.0 DEG CELSIUS |
| TERMINAL TYPE AND QUANTITY | 28 LEADLESS |
| TERMINAL SURFACE TREATMENT | SOLDER |
| INCLOSURE CONFIGURATION | LEADLESS FLAT PACK |
| INCLOSURE MATERIAL | CERAMIC |
| CASE OUTLINE SOURCE AND DESIGNATOR | C-4 MIL-M-38510 |
| BODY LENGTH | 0.442 INCHES MINIMUM AND 0.460 INCHES MAXIMUM |
| BODY HEIGHT | 0.060 INCHES MINIMUM AND 0.100 INCHES MAXIMUM |
| BODY WIDTH | 0.442 INCHES MINIMUM AND 0.460 INCHES MAXIMUM |
| MAXIMUM POWER DISSIPATION RATING | 1.2 WATTS |
| STORAGE TEMP RANGE | -65.0 TO +150.0 DEG CELSIUS |
| FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND ULTRAVIOLET ERASABLE AND MONOLITHIC |
| TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |