NSN 5962-01-305-0469

Part Details | MEMORY MICROCIRCUIT

5962-01-305-0469 A circuit designed to store information and/or coded instructions. Item has pins or other connections to install in a computer or computing device. Does not include magnetic drums, tapes, punched cards or the like. For items that have portable type connections see MEMORY, PORTABLE, SOLID STATE.

Alternate Parts: AM27PS191FMB, AM27PS191BKA, AM27PS191/BKA, ROMPROM, ROM/PROM, 29683AFMB, 7566537017, 7566537-017, 5962-01-305-0469, 01-305-0469, 5962013050469, 013050469

Supply Group (FSG) NSN Assigned NIIN Item Name Code (INC)
59JUL 31, 198901-305-046941015 ( MICROCIRCUIT, MEMORY )
REFERENCE DRAWINGS & PICTURES
Cross Reference | NSN 5962-01-305-0469
Part Number Cage Code Manufacturer
AM27PS191FMB34335ADVANCED MICRO DEVICES, INC.DBA A M D
AM27PS191/BKA34335ADVANCED MICRO DEVICES, INC.DBA A M D
ROM/PROM16236DLA LAND AND MARITIMEDBA ENGINEERING AND TECHNICAL
29683AFMB07933FAIRCHILD SEMICONDUCTOR CORPSEMICONDUCTOR DIV HQ
7566537-01713160GENERAL DYNAMICS LAND SYSTEMS INC.DBA WOODBRIDGE TECHNICAL CENTER
Technical Data | NSN 5962-01-305-0469
Characteristic Specifications
OUTPUT LOGIC FORM TRANSISTOR-TRANSISTOR LOGIC
INPUT CIRCUIT PATTERN 14 INPUT
VOLTAGE RATING AND TYPE PER CHARACTERISTICACV7.0 VOLTS MAXIMUM
MEMORY DEVICE TYPE ROM
OPERATING TEMP RANGE-55.0 TO +125.0 DEG CELSIUS
TERMINAL TYPE AND QUANTITY24 FLAT LEADS
TERMINAL SURFACE TREATMENT SOLDER
INCLOSURE CONFIGURATION FLAT PACK
INCLOSURE MATERIAL CERAMIC
CASE OUTLINE SOURCE AND DESIGNATORF-6 MIL-M-38510
BODY LENGTH0.640 INCHES MAXIMUM
BODY HEIGHT0.090 INCHES MAXIMUM
BODY WIDTH0.420 INCHES MAXIMUM
MAXIMUM POWER DISSIPATION RATING900.0 MILLIWATTS
STORAGE TEMP RANGE-65.0 TO +150.0 DEG CELSIUS
FEATURES PROVIDED MONOLITHIC AND 3-STATE OUTPUT AND BIPOLAR AND ELECTROSTATIC SENSITIVE
TEST DATA DOCUMENT96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).