NSN 5962-01-305-3125
Part Details | MEMORY MICROCIRCUIT
5962-01-305-3125 A circuit designed to store information and/or coded instructions. Item has pins or other connections to install in a computer or computing device. Does not include magnetic drums, tapes, punched cards or the like. For items that have portable type connections see MEMORY, PORTABLE, SOLID STATE.
Alternate Parts: AMPAL16L8ALB2A, AMPAL16L8AL/B2A, 59628515505B2A, 5962-8515505B2A, 596285155, 5962-85155, ROMPROM HEAD 125, ROM/PROM HEAD 125, 596285155052A, 5962-85155052A, 59628515505B2X, 5962-8515505B2X, 59628515505B2B, 5962-8515505B2B, PAL16L8B2ML883B, PAL16L8B-2ML/883B, TIBPAL16L830MPKB, TIBPAL16L8-30MPKB, 5962-01-305-3125, 01-305-3125, 5962013053125, 013053125
| Supply Group (FSG) | NSN Assigned | NIIN | Item Name Code (INC) |
|---|---|---|---|
| 59 | AUG 03, 1989 | 01-305-3125 | 41015 ( MICROCIRCUIT, MEMORY ) |
REFERENCE DRAWINGS & PICTURES
Cross Reference | NSN 5962-01-305-3125
| Part Number | Cage Code | Manufacturer |
|---|---|---|
| AMPAL16L8AL/B2A | 34335 | ADVANCED MICRO DEVICES, INC.DBA A M D |
| 5962-8515505B2A | 67268 | DLA LAND AND MARITIMEDBA ENGINEERING AND TECHNICAL |
| 5962-85155 | 67268 | DLA LAND AND MARITIMEDBA ENGINEERING AND TECHNICAL |
| ROM/PROM HEAD 125 | 16236 | DLA LAND AND MARITIMEDBA ENGINEERING AND TECHNICAL |
| 5962-85155052A | 67268 | DLA LAND AND MARITIMEDBA ENGINEERING AND TECHNICAL |
| 5962-8515505B2X | 67268 | DLA LAND AND MARITIMEDBA ENGINEERING AND TECHNICAL |
| 5962-8515505B2B | 67268 | DLA LAND AND MARITIMEDBA ENGINEERING AND TECHNICAL |
| PAL16L8B-2ML/883B | 50364 | MMI/AMD |
| TIBPAL16L8-30MPKB | 01295 | TEXAS INSTRUMENTS INCORPORATEDDBA TEXAS INSTRUMENTS |
Technical Data | NSN 5962-01-305-3125
| Characteristic | Specifications |
|---|---|
| OUTPUT LOGIC FORM | BIPOLAR METAL-OXIDE SEMICONDUCTOR |
| INPUT CIRCUIT PATTERN | 16 INPUT |
| VOLTAGE RATING AND TYPE PER CHARACTERISTIC | ACV5.0 VOLTS NOMINAL |
| CURRENT RATING PER CHARACTERISTIC | BACGX12.00 MILLIAMPERES NOMINAL |
| MEMORY DEVICE TYPE | PAL |
| OPERATING TEMP RANGE | -55.0 TO +125.0 DEG CELSIUS |
| TERMINAL TYPE AND QUANTITY | 20 PIN |
| TERMINAL SURFACE TREATMENT | SOLDER |
| INCLOSURE CONFIGURATION | LEADED CHIP CARRIER |
| INCLOSURE MATERIAL | CERAMIC |
| CASE OUTLINE SOURCE AND DESIGNATOR | C-2 MIL-M-38510 |
| BODY LENGTH | 0.358 INCHES MAXIMUM |
| BODY HEIGHT | 0.088 INCHES MAXIMUM |
| BODY WIDTH | 0.358 INCHES MAXIMUM |
| MAXIMUM POWER DISSIPATION RATING | 1.2 WATTS |
| STORAGE TEMP RANGE | -65.0 TO +150.0 DEG CELSIUS |
| FEATURES PROVIDED | BIPOLAR AND BURN IN AND MONOLITHIC AND PROGRAMMABLE |
| TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| OVERALL LENGTH | 0.358 INCHES MAXIMUM |
| OVERALL WIDTH | 0.358 INCHES MAXIMUM |
| OVERALL HEIGHT | 0.100 INCHES MAXIMUM |