NSN 5962-01-309-3322
Part Details | MEMORY MICROCIRCUIT
5962-01-309-3322 A circuit designed to store information and/or coded instructions. Item has pins or other connections to install in a computer or computing device. Does not include magnetic drums, tapes, punched cards or the like. For items that have portable type connections see MEMORY, PORTABLE, SOLID STATE.
Alternate Parts: ROMPROM, ROM/PROM, 40007985003, 40007985-003, M2716F1, 5962-01-309-3322, 01-309-3322, 5962013093322, 013093322
| Supply Group (FSG) | NSN Assigned | NIIN | Item Name Code (INC) |
|---|---|---|---|
| 59 | OCT 16, 1989 | 01-309-3322 | 41015 ( MICROCIRCUIT, MEMORY ) |
REFERENCE DRAWINGS & PICTURES
Cross Reference | NSN 5962-01-309-3322
| Part Number | Cage Code | Manufacturer |
|---|---|---|
| ROM/PROM | 16236 | DLA LAND AND MARITIMEDBA ENGINEERING AND TECHNICAL |
| 40007985-003 | 96238 | DNE TECHNOLOGIES, INC. |
| M2716F1 | 66958 | STMICROELECTRONICS INC |
Technical Data | NSN 5962-01-309-3322
| Characteristic | Specifications |
|---|---|
| VOLTAGE RATING AND TYPE PER CHARACTERISTIC | ACV6.0 VOLTS MAXIMUM |
| TIME RATING PER CHACTERISTIC | NSCADT450.00 NANOSECONDS |
| MEMORY DEVICE TYPE | ROM |
| OPERATING TEMP RANGE | +0.0 TO +70.0 DEG CELSIUS |
| TERMINAL TYPE AND QUANTITY | 24 PRINTED CIRCUIT |
| TERMINAL SURFACE TREATMENT | SOLDER |
| INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| INCLOSURE MATERIAL | CERAMIC |
| FEATURES PROVIDED | HERMETICALLY SEALED AND PROGRAMMED |