NSN 5962-01-310-7305

Part Details | MEMORY MICROCIRCUIT

5962-01-310-7305 A circuit designed to store information and/or coded instructions. Item has pins or other connections to install in a computer or computing device. Does not include magnetic drums, tapes, punched cards or the like. For items that have portable type connections see MEMORY, PORTABLE, SOLID STATE.

Alternate Parts: ROMPROM FAMILY 022, ROM/PROM FAMILY 022, 53301F883C, 5330-1F883C, 32213003, 3221300-3, 82S23BFA, 82S23/BFA, 7173934, 717393-4, 5962-01-310-7305, 01-310-7305, 5962013107305, 013107305

Supply Group (FSG) NSN Assigned NIIN Item Name Code (INC)
59NOV 12, 198901-310-730541015 ( MICROCIRCUIT, MEMORY )
REFERENCE DRAWINGS & PICTURES
Cross Reference | NSN 5962-01-310-7305
Part Number Cage Code Manufacturer
ROM/PROM FAMILY 02216236DLA LAND AND MARITIMEDBA ENGINEERING AND TECHNICAL
5330-1F883C50364MMI/AMD
3221300-310001NAVAIR AND NAVSEA MANAGEDORIGINAL DESIGN ACTIVITY DWG NOT
82S23/BFA18324PHILIPS SEMICONDUCTORS INC
717393-405869RAYTHEON COMPANYDBA RAYTHEON
Technical Data | NSN 5962-01-310-7305
Characteristic Specifications
OUTPUT LOGIC FORM TRANSISTOR-TRANSISTOR LOGIC
INPUT CIRCUIT PATTERN 6 INPUT
VOLTAGE RATING AND TYPE PER CHARACTERISTICACV7.0 VOLTS MAXIMUM
TIME RATING PER CHACTERISTICNSCAEE50.00 NANOSECONDS AND NSCAED50.00 NANOSECONDS
MEMORY DEVICE TYPE ROM
OPERATING TEMP RANGE-55.0 TO +125.0 DEG CELSIUS
TERMINAL TYPE AND QUANTITY16 FLAT LEADS
TERMINAL SURFACE TREATMENT SOLDER
INCLOSURE CONFIGURATION FLAT PACK
INCLOSURE MATERIAL CERAMIC
CASE OUTLINE SOURCE AND DESIGNATORF-5 MIL-M-38510
BODY LENGTH0.440 INCHES MAXIMUM
BODY HEIGHT0.085 INCHES MAXIMUM
BODY WIDTH0.285 INCHES MAXIMUM
MAXIMUM POWER DISSIPATION RATING332.8 MILLIWATTS
STORAGE TEMP RANGE-65.0 TO +150.0 DEG CELSIUS
FEATURES PROVIDED MONOLITHIC AND W/OPEN COLLECTOR AND BIPOLAR AND PROGRAMMABLE
TEST DATA DOCUMENT96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).