NSN 5962-01-314-9738

Part Details | MEMORY MICROCIRCUIT

5962-01-314-9738 A circuit designed to store information and/or coded instructions. Item has pins or other connections to install in a computer or computing device. Does not include magnetic drums, tapes, punched cards or the like. For items that have portable type connections see MEMORY, PORTABLE, SOLID STATE.

Alternate Parts: ROMPROM, ROM/PROM, 82S191B3A, 82S191/B3A, S82S191G883B, G202271853, G202271-853, G202271853, G202271-853, G202271853, G202271-853, 5962-01-314-9738, 01-314-9738, 5962013149738, 013149738

Supply Group (FSG) NSN Assigned NIIN Item Name Code (INC)
59FEB 09, 199001-314-973841015 ( MICROCIRCUIT, MEMORY )
REFERENCE DRAWINGS & PICTURES
Cross Reference | NSN 5962-01-314-9738
Part Number Cage Code Manufacturer
ROM/PROM16236DLA LAND AND MARITIMEDBA ENGINEERING AND TECHNICAL
82S191/B3A18324PHILIPS SEMICONDUCTORS INC
S82S191G883B18324PHILIPS SEMICONDUCTORS INC
G202271-85354X10RAYTHEON COMPANYDBA RAYTHEON
G202271-85349956RAYTHEON COMPANYDBA RAYTHEON
G202271-8533B150RAYTHEON COMPANYDBA RAYTHEON
Technical Data | NSN 5962-01-314-9738
Characteristic Specifications
OUTPUT LOGIC FORM TRANSISTOR-TRANSISTOR LOGIC
INPUT CIRCUIT PATTERN 15 INPUT
VOLTAGE RATING AND TYPE PER CHARACTERISTICACV7.0 VOLTS MAXIMUM
MEMORY DEVICE TYPE ROM
OPERATING TEMP RANGE-55.0 TO +125.0 DEG CELSIUS
TERMINAL TYPE AND QUANTITY28 LEADLESS
TERMINAL SURFACE TREATMENT SOLDER
INCLOSURE CONFIGURATION LEADLESS FLAT PACK
INCLOSURE MATERIAL CERAMIC
STORAGE TEMP RANGE-65.0 TO +150.0 DEG CELSIUS
FEATURES PROVIDED BIPOLAR AND BURN IN AND ELECTROSTATIC SENSITIVE AND MONOLITHIC AND PROGRAMMABLE AND SCHOTTKY AND 3-STATE OUTPUT