NSN 5962-01-330-5525
Part Details | MEMORY MICROCIRCUIT
5962-01-330-5525 A circuit designed to store information and/or coded instructions. Item has pins or other connections to install in a computer or computing device. Does not include magnetic drums, tapes, punched cards or the like. For items that have portable type connections see MEMORY, PORTABLE, SOLID STATE.
Alternate Parts: 8506403743, 8506403-743, IDT7142LA90L48B, 5962-01-330-5525, 01-330-5525, 5962013305525, 013305525
| Supply Group (FSG) | NSN Assigned | NIIN | Item Name Code (INC) |
|---|---|---|---|
| 59 | DEC 05, 1990 | 01-330-5525 | 41015 ( MICROCIRCUIT, MEMORY ) |
REFERENCE DRAWINGS & PICTURES
Cross Reference | NSN 5962-01-330-5525
| Part Number | Cage Code | Manufacturer |
|---|---|---|
| 8506403-743 | 07187 | HONEYWELL INTERNATIONAL INC.DBA HONEYWELL |
| IDT7142LA90L48B | 61772 | INTEGRATED DEVICE TECHNOLOGY INC |
Technical Data | NSN 5962-01-330-5525
| Characteristic | Specifications |
|---|---|
| OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| VOLTAGE RATING AND TYPE PER CHARACTERISTIC | ACV5.0 VOLTS MAXIMUM |
| TIME RATING PER CHACTERISTIC | NSCAEE90.00 NANOSECONDS AND NSCAED90.00 NANOSECONDS |
| MEMORY DEVICE TYPE | ROM |
| OPERATING TEMP RANGE | -55.0 TO +125.0 DEG CELSIUS |
| TERMINAL TYPE AND QUANTITY | 48 PRINTED CIRCUIT |
| TERMINAL SURFACE TREATMENT | SOLDER |
| INCLOSURE CONFIGURATION | LEADLESS FLAT PACK |
| INCLOSURE MATERIAL | CERAMIC |
| BODY LENGTH | 0.554 INCHES MINIMUM AND 0.572 INCHES MAXIMUM |
| BODY HEIGHT | 0.055 INCHES MINIMUM AND 0.125 INCHES MAXIMUM |
| BODY WIDTH | 0.554 INCHES MINIMUM AND 0.572 INCHES MAXIMUM |
| MAXIMUM POWER DISSIPATION RATING | 1.0 WATTS |
| STORAGE TEMP RANGE | -65.0 TO +150.0 DEG CELSIUS |
| FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND STATIC OPERATION AND 3-STATE OUTPUT |
| TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |