NSN 5962-01-335-3514
Part Details | MEMORY MICROCIRCUIT
5962-01-335-3514 A circuit designed to store information and/or coded instructions. Item has pins or other connections to install in a computer or computing device. Does not include magnetic drums, tapes, punched cards or the like. For items that have portable type connections see MEMORY, PORTABLE, SOLID STATE.
Alternate Parts: ROMPROM, ROM/PROM, 8516221100, 8516221-100, 8507005183, 8507005-183, 10133870, 5962-01-335-3514, 01-335-3514, 5962013353514, 013353514
| Supply Group (FSG) | NSN Assigned | NIIN | Item Name Code (INC) |
|---|---|---|---|
| 59 | MAR 07, 1991 | 01-335-3514 | 41015 ( MICROCIRCUIT, MEMORY ) |
REFERENCE DRAWINGS & PICTURES
Cross Reference | NSN 5962-01-335-3514
| Part Number | Cage Code | Manufacturer |
|---|---|---|
| ROM/PROM | 16236 | DLA LAND AND MARITIMEDBA ENGINEERING AND TECHNICAL |
| 8516221-100 | 07187 | HONEYWELL INTERNATIONAL INC.DBA HONEYWELL |
| 8507005-183 | 07187 | HONEYWELL INTERNATIONAL INC.DBA HONEYWELL |
| 10133870 | A486G | NIMIKKEISTOKESKUS NCB FINLAND |
Technical Data | NSN 5962-01-335-3514
| Characteristic | Specifications |
|---|---|
| OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| MEMORY DEVICE TYPE | ROM |
| TERMINAL TYPE AND QUANTITY | 28 LEADLESS |
| TERMINAL SURFACE TREATMENT | SOLDER |
| INCLOSURE CONFIGURATION | LEADLESS FLAT PACK |
| INCLOSURE MATERIAL | CERAMIC |
| FEATURES PROVIDED | MONOLITHIC AND PROGRAMMABLE AND ELECTROSTATIC SENSITIVE |