NSN 5962-01-363-2463
Part Details | MEMORY MICROCIRCUIT
5962-01-363-2463 A circuit designed to store information and/or coded instructions. Item has pins or other connections to install in a computer or computing device. Does not include magnetic drums, tapes, punched cards or the like. For items that have portable type connections see MEMORY, PORTABLE, SOLID STATE.
Alternate Parts: ROMPROM, ROM/PROM, 59628515506SA, 5962-8515506SA, 123A8825, 123A882-5, 5962-01-363-2463, 01-363-2463, 5962013632463, 013632463
| Supply Group (FSG) | NSN Assigned | NIIN | Item Name Code (INC) |
|---|---|---|---|
| 59 | AUG 27, 1992 | 01-363-2463 | 41015 ( MICROCIRCUIT, MEMORY ) |
REFERENCE DRAWINGS & PICTURES
Cross Reference | NSN 5962-01-363-2463
| Part Number | Cage Code | Manufacturer |
|---|---|---|
| ROM/PROM | 16236 | DLA LAND AND MARITIMEDBA ENGINEERING AND TECHNICAL |
| 5962-8515506SA | 67268 | DLA LAND AND MARITIMEDBA ENGINEERING AND TECHNICAL |
| 123A882-5 | 03640 | LOCKHEED MARTIN CORPORATIONDBA LOCKHEED MARTIN |
Technical Data | NSN 5962-01-363-2463
| Characteristic | Specifications |
|---|---|
| INPUT CIRCUIT PATTERN | 16 INPUT |
| VOLTAGE RATING AND TYPE PER CHARACTERISTIC | ACV7.0 VOLTS MAXIMUM |
| MEMORY DEVICE TYPE | PAL |
| OPERATING TEMP RANGE | -55.0 TO +125.0 DEG CELSIUS |
| TERMINAL TYPE AND QUANTITY | 20 FLAT LEADS |
| TERMINAL SURFACE TREATMENT | SOLDER |
| INCLOSURE CONFIGURATION | FLAT PACK |
| INCLOSURE MATERIAL | CERAMIC |
| CASE OUTLINE SOURCE AND DESIGNATOR | F-9 MIL-M-38510 |
| MAXIMUM POWER DISSIPATION RATING | 1.1 WATTS |
| STORAGE TEMP RANGE | -65.0 TO +150.0 DEG CELSIUS |
| FEATURES PROVIDED | BURN IN AND ELECTROSTATIC SENSITIVE AND BIPOLAR AND MONOLITHIC AND PROGRAMMED |
| TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |