NSN 5962-01-365-1420
Part Details | HYBRID MICROCIRCUIT
5962-01-365-1420 A circuit in which one type of microcircuit is combined with some other type of microcircuit or with discrete components. For two microcircuits on a common mounting or on each other, see MICROCIRCUIT ASSEMBLY. For microcircuits having a complete independent memory function, see MICROCIRCUIT (1), MEMORY.
Alternate Parts: 2663788G001, 900110511, 900-11051-1, 5962-01-365-1420, 01-365-1420, 5962013651420, 013651420
| Supply Group (FSG) | NSN Assigned | NIIN | Item Name Code (INC) |
|---|---|---|---|
| 59 | OCT 01, 1992 | 01-365-1420 | 41014 ( MICROCIRCUIT, HYBRID ) |
REFERENCE DRAWINGS & PICTURES
Cross Reference | NSN 5962-01-365-1420
| Part Number | Cage Code | Manufacturer |
|---|---|---|
| 2663788G001 | 28527 | HARRIS CORPORATIONDBA ELECTRONIC SYSTEMS, INTEGRATED |
| 900-11051-1 | 81205 | THE BOEING COMPANYDBA BOEING |
Technical Data | NSN 5962-01-365-1420
| Characteristic | Specifications |
|---|---|
| DESIGN FUNCTION AND QUANTITY | 1 ARITHMETIC LOGIC UNIT AND 1 CONTROL, MEMORY ACCESS AND 1 LATCH AND 3 REGISTER |
| INPUT CIRCUIT PATTERN | 55 INPUT AND 3 INPUT |
| VOLTAGE RATING AND TYPE PER CHARACTERISTIC | ACV5.5 VOLTS MAXIMUM |
| OPERATING TEMP RANGE | -55.0 TO +125.0 DEG CELSIUS |
| TERMINAL TYPE AND QUANTITY | 94 FLAT LEADS |
| TERMINAL SURFACE TREATMENT | SOLDER |
| INCLOSURE CONFIGURATION | FLAT PACK |
| INCLOSURE MATERIAL | CERAMIC |
| HYBRID TECHNOLOGY TYPE | MONOLITHIC |
| STORAGE TEMP RANGE | -65.0 TO +150.0 DEG CELSIUS |
| FEATURES PROVIDED | BURN IN AND HYBRID AND ELECTROSTATIC SENSITIVE |