NSN 5962-01-370-1468

Part Details | MEMORY MICROCIRCUIT

5962-01-370-1468 A circuit designed to store information and/or coded instructions. Item has pins or other connections to install in a computer or computing device. Does not include magnetic drums, tapes, punched cards or the like. For items that have portable type connections see MEMORY, PORTABLE, SOLID STATE.

Alternate Parts: 59628552604LA, 5962-8552604LA, ROMPROM, ROM/PROM, 1212248216, 1212248-216, 1212248216, 1212248-216, 5962-01-370-1468, 01-370-1468, 5962013701468, 013701468

Supply Group (FSG) NSN Assigned NIIN Item Name Code (INC)
59JAN 14, 199301-370-146841015 ( MICROCIRCUIT, MEMORY )
REFERENCE DRAWINGS & PICTURES
Cross Reference | NSN 5962-01-370-1468
Part Number Cage Code Manufacturer
5962-8552604LA67268DLA LAND AND MARITIMEDBA ENGINEERING AND TECHNICAL
ROM/PROM16236DLA LAND AND MARITIMEDBA ENGINEERING AND TECHNICAL
1212248-21656232LOCKHEED MARTIN CORPORATIONDBA LOCKHEED MARTIN
1212248-21603538LOCKHEED MARTIN CORPORATIONDIV RMS
Technical Data | NSN 5962-01-370-1468
Characteristic Specifications
OUTPUT LOGIC FORM BIPOLAR METAL-OXIDE SEMICONDUCTOR
VOLTAGE RATING AND TYPE PER CHARACTERISTICADNM0.5 VOLTS MINIMUM AND ADN7.0 VOLTS MAXIMUM
CURRENT RATING PER CHARACTERISTICBABHUM30.00 MILLIAMPERES NOMINAL AND BACHU5.00 MILLIAMPERES NOMINAL
TIME RATING PER CHACTERISTICNSAADR65.00 NANOSECONDS
MEMORY DEVICE TYPE PROM
OPERATING TEMP RANGE-55.0 TO +125.0 DEG CELSIUS
TERMINAL TYPE AND QUANTITY24 PRINTED CIRCUIT
TERMINAL SURFACE TREATMENT SOLDER
INCLOSURE CONFIGURATION DUAL-IN-LINE
INCLOSURE MATERIAL CERAMIC
CASE OUTLINE SOURCE AND DESIGNATORD-9 MIL-M-38510
PART NAME ASSIGNED BY CONTROLLING AGENCYMICROCIRCUIT,DIGITAL,SCHOTTKY,BIPOLAR 16384 BIT PROM
HYBRID TECHNOLOGY TYPE MONOLITHIC
MAXIMUM POWER DISSIPATION RATING1.02 WATTS
STORAGE TEMP RANGE-65.0 TO +150.0 DEG CELSIUS
FEATURES PROVIDED BIPOLAR
TEST DATA DOCUMENT96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).