NSN 5962-01-374-8574

Part Details | MEMORY MICROCIRCUIT

5962-01-374-8574 A circuit designed to store information and/or coded instructions. Item has pins or other connections to install in a computer or computing device. Does not include magnetic drums, tapes, punched cards or the like. For items that have portable type connections see MEMORY, PORTABLE, SOLID STATE.

Alternate Parts: ROMPROM, ROM/PROM, 334794P04, 334794P04, 334794P04, M38510224002BYA, M38510/224002BYA, 5962-01-374-8574, 01-374-8574, 5962013748574, 013748574

Supply Group (FSG) NSN Assigned NIIN Item Name Code (INC)
59APR 30, 199301-374-857441015 ( MICROCIRCUIT, MEMORY )
REFERENCE DRAWINGS & PICTURES
Cross Reference | NSN 5962-01-374-8574
Part Number Cage Code Manufacturer
ROM/PROM16236DLA LAND AND MARITIMEDBA ENGINEERING AND TECHNICAL
334794P0433654HOWDEN FLUID SYSTEMS
334794P0462228MEGGITT DEFENSE SYSTEMS, INC.
334794P0459027MEGGITT DEFENSE SYSTEMS, INC.DBA MEGGITT WESTERN DESIGN
M38510/224002BYA81349MILITARY SPECIFICATIONSPROMULGATED BY MILITARY
Technical Data | NSN 5962-01-374-8574
Characteristic Specifications
OUTPUT LOGIC FORM N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC
INPUT CIRCUIT PATTERN 16 INPUT
VOLTAGE RATING AND TYPE PER CHARACTERISTICACV6.25 VOLTS MAXIMUM
TIME RATING PER CHACTERISTICNSCADR250.00 NANOSECONDS
MEMORY DEVICE TYPE EPROM
OPERATING TEMP RANGE-55.0 TO +125.0 DEG CELSIUS
TERMINAL TYPE AND QUANTITY28 PRINTED CIRCUIT
TERMINAL SURFACE TREATMENT SOLDER
INCLOSURE CONFIGURATION DUAL-IN-LINE
INCLOSURE MATERIAL CERAMIC
CASE OUTLINE SOURCE AND DESIGNATORD-10 MIL-M-38510
MAXIMUM POWER DISSIPATION RATING1.0 WATTS
STORAGE TEMP RANGE-65.0 TO +150.0 DEG CELSIUS
FEATURES PROVIDED BURN IN AND ELECTROSTATIC SENSITIVE AND MONOLITHIC AND PROGRAMMED AND ULTRAVIOLET ERASABLE
TEST DATA DOCUMENT96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).