NSN 5962-01-376-7680

Part Details | MEMORY MICROCIRCUIT

5962-01-376-7680 A circuit designed to store information and/or coded instructions. Item has pins or other connections to install in a computer or computing device. Does not include magnetic drums, tapes, punched cards or the like. For items that have portable type connections see MEMORY, PORTABLE, SOLID STATE.

Alternate Parts: 74D0414411001, 74D041441-1001, ROMPROM FAMILY 269, ROM/PROM FAMILY 269, M3851026103BXA, M38510/26103BXA, 5962-01-376-7680, 01-376-7680, 5962013767680, 013767680

Supply Group (FSG) NSN Assigned NIIN Item Name Code (INC)
59JUN 08, 199301-376-768041015 ( MICROCIRCUIT, MEMORY )
REFERENCE DRAWINGS & PICTURES
Cross Reference | NSN 5962-01-376-7680
Part Number Cage Code Manufacturer
74D041441-100176301BOEING COMPANY, THEDBA BOEING
ROM/PROM FAMILY 26916236DLA LAND AND MARITIMEDBA ENGINEERING AND TECHNICAL
M38510/26103BXA81349MILITARY SPECIFICATIONSPROMULGATED BY MILITARY
Technical Data | NSN 5962-01-376-7680
Characteristic Specifications
OUTPUT LOGIC FORM COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
VOLTAGE RATING AND TYPE PER CHARACTERISTICACVM0.5 VOLTS MINIMUM AND ACV6.0 VOLTS MAXIMUM
CURRENT RATING PER CHARACTERISTICBACHG80.00 MILLIAMPERES NOMINAL
CAPITANCE RATING PER CHARACTERISTICBPFC10.00 INPUT AND FPFC10.00 OUTPUT
TIME RATING PER CHACTERISTICNSCADR250.00 NANOSECONDS
MEMORY DEVICE TYPE EEPROM
OPERATING TEMP RANGE-55.0 TO +125.0 DEG CELSIUS
TERMINAL TYPE AND QUANTITY28 PRINTED CIRCUIT
TERMINAL SURFACE TREATMENT SOLDER
INCLOSURE CONFIGURATION DUAL-IN-LINE
INCLOSURE MATERIAL CERAMIC
CASE OUTLINE SOURCE AND DESIGNATORD-10 MIL-M-38510
BODY LENGTH1.490 INCHES MAXIMUM
BODY HEIGHT0.217 INCHES MAXIMUM
BODY WIDTH0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM
MAXIMUM POWER DISSIPATION RATING1.0 WATTS
STORAGE TEMP RANGE-65.0 TO +125.0 DEG CELSIUS
FEATURES PROVIDED PROGRAMMED AND HIGH IMPEDANCE AND W/ENABLE AND W/DISABLE AND MONOLITHIC
TEST DATA DOCUMENT96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).